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solder replacement adhesives

Materion Wambraze™ WB1121 Solder
Categories: Metal; Nonferrous Metal; Precious Metal; Gold Alloy; Solder/Braze Alloy

Material Notes: High-purity vacuum cast materials are manufactured by Williams in a variety of solder alloys, including gold brazing alloys for electronic packaging and high temperature joining vacuum electronic devices. All Williams solder alloys and gold brazing alloys are available in a variety of shapes and forms, including ribbon, preform, rod, ring, wire, and custom shapes. Powders are available in select WAMBRAZE™ alloys.

Trace Impurities for Brazing Alloys:

  • C: 50 ppm max
  • P and Pb*: 20 ppm max
  • Ca*, Cd*, Cs*, Li*, Mg*, Na*, Rb*, S*, Sb*, Se*, Sr*, Te*, Ti*, Zn*: each 10 ppm max
  • Total* 100 ppm max
  • Hg: None detected

Information provided by Williams Advanced Alloys

Former product of Williams Advanced Alloys. Williams Advanced Alloys is now a part of Materion.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 13.38 g/cc0.4834 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 855 MPa124000 psi
Tensile Strength, Yield 717 MPa104000 psi
Elongation at Break 23.7 %23.7 %
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.0000374 ohm-cm0.0000374 ohm-cm4.6% IACS
 
Thermal PropertiesMetricEnglishComments
CTE, linear 15.5 µm/m-°C
@Temperature 20.0 - 600 °C
8.61 µin/in-°F
@Temperature 68.0 - 1110 °F
Thermal Conductivity 29.0 W/m-K201 BTU-in/hr-ft²-°F
Melting Point 1102 - 1121 °C2016 - 2050 °F
Solidus 1102 °C2016 °F
Liquidus 1121 °C2050 °F
 
Component Elements PropertiesMetricEnglishComments
Gold, Au 50 %50 %
Nickel, Ni 25 %25 %
Palladium, Pd 25 %25 %
 
Descriptive Properties
AWS/AMS NumbersAMS 4784; AWS BVAu-7
Compare To:Palniro 1

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NWILL03 / 19891

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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