Henkel Loctite® ABLESTIK ATB F125E Epoxy Film

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Henkel Loctite® ABLESTIK ATB F125E Epoxy Film
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: White Cure: Ultraviolet (UV) light or Heat cure Product Benefits: Excellent workability High reliability Ideal modulus for wide range of package sizes Meets thin wafer requirements Recommended for small die size packages Consistent dicing and die pickup for small die applications Long work life, up to 4 months Application: Die attach Typical Package Application: Discrete, IC and Chip stack packages LOCTITE ABLESTIK ATB F125E adhesive film is formulated for use in wafer lamination processes or as a preform decal. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	0.780 %

Mechanical Properties	Original Value	Comments
Tensile Modulus	185 MPa @Temperature 250 °C	Cured, DMTA
	368 MPa @Temperature 200 °C	Cured, DMTA
	1092 MPa @Temperature 150 °C	Cured, DMTA
	5256 MPa @Temperature 25.0 °C	Cured, DMTA
	9755 MPa @Temperature -65.0 °C	Cured, DMTA

Thermal Properties	Original Value	Comments
CTE, linear	37.0 µm/m-°C	Cured, TMA, Below Tg
	83.0 µm/m-°C	Cured, TMA, Above Tg
Glass Transition Temp, Tg	215 °C	Cured, DMTA
	215 °C

Processing Properties	Original Value	Comments
Cure Time	1.00 hour @Temperature 130 °C
Shelf Life	1.00 Month	Uncured, Work life, Before lamination
	3.00 Month	Uncured, Work life, After lamination to die attach
	12.0 Month @Temperature 5.00 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	1	Cured, Potassium (K+)
	19	Cured, Chloride (Cl-)
	2	Cured, Sodium (Na+)
Shear Strength	3.1 kg-f/die	Die, 2.5 X 2.5 mm (100 x 100 mil), Si die on BT substrate @ 260°C
Weight Loss (%)	0.27	Cured @ 200ºC, TGA,

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PLOCT5049 / 255260

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