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Elmet Technologies

Henkel Loctite® ABLESTIK ATB F125E Epoxy Film
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: White

Cure: Ultraviolet (UV) light or Heat cure

Product Benefits:

  • Excellent workability
  • High reliability
  • Ideal modulus for wide range of package sizes
  • Meets thin wafer requirements
  • Recommended for small die size packages
  • Consistent dicing and die pickup for small die applications
  • Long work life, up to 4 months
Application: Die attach

Typical Package Application: Discrete, IC and Chip stack packages

LOCTITE ABLESTIK ATB F125E adhesive film is formulated for use in wafer lamination processes or as a preform decal.

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Moisture Absorption 0.780 %0.780 %
 
Mechanical PropertiesMetricEnglishComments
Tensile Modulus  0.185 GPa
@Temperature 250 °C
26.8 ksi
@Temperature 482 °F
Cured, DMTA
 0.368 GPa
@Temperature 200 °C
53.4 ksi
@Temperature 392 °F
Cured, DMTA
 1.092 GPa
@Temperature 150 °C
158.4 ksi
@Temperature 302 °F
Cured, DMTA
 5.256 GPa
@Temperature 25.0 °C
762.3 ksi
@Temperature 77.0 °F
Cured, DMTA
 9.755 GPa
@Temperature -65.0 °C
1415 ksi
@Temperature -85.0 °F
Cured, DMTA
 
Thermal PropertiesMetricEnglishComments
CTE, linear 37.0 µm/m-°C20.6 µin/in-°FCured, TMA, Below Tg
 83.0 µm/m-°C46.1 µin/in-°FCured, TMA, Above Tg
Glass Transition Temp, Tg 215 °C419 °FCured, DMTA
 215 °C419 °F
 
Processing PropertiesMetricEnglishComments
Cure Time 60.0 min
@Temperature 130 °C
1.00 hour
@Temperature 266 °F
Shelf Life 1.00 Month1.00 MonthUncured, Work life, Before lamination
 3.00 Month3.00 MonthUncured, Work life, After lamination to die attach
 12.0 Month
@Temperature 5.00 °C
12.0 Month
@Temperature 41.0 °F
Uncured, from date of manufacture
 
Descriptive Properties
Extractable Ionic Content (ppm)1Cured, Potassium (K+)
 19Cured, Chloride (Cl-)
 2Cured, Sodium (Na+)
Shear Strength3.1 kg-f/dieDie, 2.5 X 2.5 mm (100 x 100 mil), Si die on BT substrate @ 260°C
Weight Loss (%)0.27Cured @ 200ºC, TGA,

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PLOCT5049 / 255260

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