LORD CoolTherm™ EP-6007 BLK resin is a ceramic filled epoxy resin specifically formulated for use with CoolTherm or Thermoset™ hardeners to create a two component system. This system is recommended for use as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting and casting product for applications where thermal conductivity and non-burning properties are required. Features: provides high thermal conductivity for applications where superior heat transfer is required. provides excellent high voltage insulation. exhibits low exotherm heat rise during room temperature cure. can be used on parts and devices that experience operating temperatures from -55°C to +130°C. provides excellent flame retardancy; UL 94 V-0 certified; meets requirements of Military Specifications MIL T-27 and MIL I-16923. All information provided by Lord. |