Hexcel® Redux® 322U Modified epoxy film adhesive (0.06 psf)

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Hexcel® Redux® 322U Modified epoxy film adhesive (0.06 psf)
Categories:	Polymer; Adhesive; Film; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	Redux 322 is a high performance modified epoxy film adhesive curing at 350°F. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 430°F for short periods, or 390°F for continuous operation. Redux 322 is a hot melt film which is free from solvents and consequently has a very low volatile content. Features: Cure at 350°F; Good co-cure potential with 350°F curing prepregs; Good hot lap shear performance; Good high temperature performance in metal sandwich structures; Low volatile content and low out gassing properties; Available with or without a woven nylon carrier. Applications: Metal to metal bonding; Sandwich constructions.
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Physical Properties	Metric	English	Comments

Outgassing - Total Mass Loss	0.41 %	0.41 %	Recovered Mass Loss (RML), Typical result; ESA PSS-01-702
	1.74 %	1.74 %	Total Mass Loss (TML), Typical result; ESA PSS-01-702
Collected Volatile Condensable Material	0.00 %	0.00 %	ESA PSS-01-702

Mechanical Properties	Metric	English	Comments
Tensile Strength, Yield	6.998 MPa @Temperature 149 °C	1015 psi @Temperature 300 °F	Flatwise Tension
	8.998 MPa @Temperature 21.1 °C	1305 psi @Temperature 70.0 °F	Flatwise Tension
Shear Strength	22.0 MPa @Temperature 21.1 °C	3190 psi @Temperature 70.0 °F	Lap Shear
	26.0 MPa @Temperature 149 °C	3770 psi @Temperature 300 °F	Lap Shear

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	199 °C	390 °F
	221 °C	430 °F

Processing Properties	Metric	English	Comments
Shelf Life	18.0 Month @Temperature -17.8 °C	18.0 Month @Temperature 0.000 °F

Descriptive Properties
Areal Weight (psf)	0.06
Climbing Drum Peel (in-lb/3in)	10.1		70°F
Roll Width (in)	21
Standard Roll (ft2)	430
Support	None

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PHEXC444 / 99263

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