Redux 322 is a high performance modified epoxy film adhesive curing at 350°F. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 430°F for short periods, or 390°F for continuous operation. Redux 322 is a hot melt film which is free from solvents and consequently has a very low volatile content.Features: Cure at 350°F; Good co-cure potential with 350°F curing prepregs; Good hot lap shear performance; Good high temperature performance in metal sandwich structures; Low volatile content and low out gassing properties; Available with or without a woven nylon carrier. Applications: Metal to metal bonding; Sandwich constructions. |