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Proto3000 – 3D Engineering Solutions

Atom Adhesives AA-BOND G298 Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.

Appearance: Resin: Brown, Hardener: Dark Brown

Cure Type: Heat cure or Room temperature

Benefits:

  • Gold filled epoxy allows for antioxidation of contacts and terminals in high reliability devices.
  • It can be used in medical circuits using traditional hybrid packaging technologies.
  • High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes.
Mix Ratio by weight: 100:13.5/Resin:Hardener

Substrates: Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics

Typical Application:

  • Adhesive for joining die and SMDs onto the hybrid circuits.
  • Repairing defective Au thick-film conductor traces and contact pads.
  • Resisting oxidation and electromigration in high-reliability microelectronics.
  • Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300°C.

Information provided by Atom Adhesives

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Particle Size <= 50 µm<= 50 µmuncured
Viscosity >= 400000 cP>= 400000 cP0.5 rpm, uncured
 
Mechanical PropertiesMetricEnglishComments
Shear Strength 11.7 MPa1700 psiDie, @ 23°C: = 5 Kg
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.00090 ohm-cm<= 0.00090 ohm-cm
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 275 °C527 °FContinuous
 375 °C707 °FIntermittent
Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
 -55.0 °C-67.0 °FIntermittent
Glass Transition Temp, Tg >= 100 °C>= 212 °FDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 483 °C901 °FTGA, Degradation Temp, uncured
 
Processing PropertiesMetricEnglishComments
Cure Time  15.0 min
@Temperature 120 °C
0.250 hour
@Temperature 248 °F
 90.0 min
@Temperature 80.0 °C
1.50 hour
@Temperature 176 °F
 600 min
@Temperature 50.0 °C
10.0 hour
@Temperature 122 °F
 1440 min
@Temperature 25.0 °C
24.0 hour
@Temperature 77.0 °F
Pot Life 30.0 min30.0 minuncured
Shelf Life 12.0 Month12.0 Month

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PATOM043 / 172358

Aluminum Castings

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