Atom Adhesives AA-BOND 2112 Epoxy Adhesive

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Atom Adhesives AA-BOND 2112 Epoxy Adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics. AA-BOND 2112 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics. AA-BOND 2112 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. The cured adhesive provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds. Appearance: Milky Translucent Cure Type: Heat cure or Room Temperature Benefits: Tough enamel like cure Bonds variety of substrates Good electrical insulation Weather resistant Mix Ratio by weight: 100:22/Resin:Hardener Substrates: metals, glass, ceramics, wood and many plastics Typical Application: Printed circuit board repair, staking components, bonding, laminating and repair applications Information provided by Atom Adhesives
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Physical Properties	Original Value	Comments

Specific Gravity	1.20 g/cc
Solids Content	100 %
Viscosity	60000 cP

Mechanical Properties	Original Value	Comments
Hardness, Shore D	90
Adhesive Bond Strength	1900 psi	Alum to Alum
Izod Impact, Notched	0.750 ft-lb/in

Electrical Properties	Original Value	Comments
Volume Resistivity	6.00e+13 ohm-cm @Temperature 100 °C
Dielectric Constant	4.6
Dissipation Factor	0.010 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	55.0 µm/m-°C
Maximum Service Temperature, Air	125 °C
Minimum Service Temperature, Air	-60.0 °C
Glass Transition Temp, Tg	93.0 °C

Processing Properties	Original Value	Comments
Cure Time	4.00 hour @Temperature 65.0 °C
	24.0 hour @Temperature 25.0 °C
Pot Life	30.0 min

Descriptive Properties
Thixotropic Index	6.5

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PATOM008 / 172323

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