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Master Bond adhesives

Materion Beryllium Copper Alloy 174 Strip; 1/2HT (TH02) Temper (UNS C17410)
Categories: Metal; Nonferrous Metal; Beryllium Alloy; Copper Alloy

Material Notes: Treatment required for max strength: Mill Hardened
Stress Relaxation-% Stress Remaining after 1000 hrs @ 100°C: 95%
Stress Relaxation after 1000 hrs @ 200°C: 67%
Formability Ratio, 90° Bend, Radius/Thickness (Good Way): 0.5
Formability Ratio (bad Way): 0.5
Superficial Hardness: 30T 75.5-81.9

Tabulated properties apply to products after age hardening. Information supplied by Brush Wellman.

Brush Engineered Materials Inc. changed its name to Materion Corporation in March 2011.

Key Words: ASTM B-768
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 8.80 g/cc0.318 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell B 89 - 9889 - 98
Hardness, Vickers 180 - 230180 - 230
Tensile Strength, Ultimate 655 - 790 MPa95000 - 115000 psi
Tensile Strength, Yield 550 - 690 MPa79800 - 100000 psi
Elongation at Break 10 - 20 %10 - 20 %
Modulus of Elasticity 138 GPa20000 ksi
Fatigue Strength 280 - 310 MPa
@# of Cycles 1.00e+8
40600 - 45000 psi
@# of Cycles 1.00e+8
Reverse Bending (R=1)
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000290 - 0.00000380 ohm-cm0.00000290 - 0.00000380 ohm-cm45-60% IACS Conductivity
 
Thermal PropertiesMetricEnglishComments
CTE, linear 18.0 µm/m-°C
@Temperature 20.0 - 200 °C
10.0 µin/in-°F
@Temperature 68.0 - 392 °F
Thermal Conductivity 230 W/m-K1600 BTU-in/hr-ft²-°F
Melting Point 1030 - 1070 °C1890 - 1960 °F
Solidus 1030 °C1890 °F
Liquidus 1070 °C1960 °F
 
Component Elements PropertiesMetricEnglishComments
Beryllium, Be 0.15 - 0.50 %0.15 - 0.50 %
Cobalt, Co 0.35 - 0.60 %0.35 - 0.60 %
Copper, Cu 99 %99 %as balance

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Copper, Mill-Hardened UNS C17410, 1/2 HT

NBB482 / 15191

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