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Master Bond adhesives

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Copper Alloy, UNS C19040, H04 Temper, Flat Products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Hard

Fabrication Properties: Excellent Suitability – Soldering, Brazing, Spot Weld, Seam Weld, Butt Weld; Good Suitability – Capacity for Being Cold Worked; Fair Suitability – Capacity for Being Hot Formed

Typical Uses: Automotive electrical terminals; Electrical and electronic terminals, connectors, Lead frames

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Physical PropertiesOriginal ValueComments
Density 0.321 lb/in³
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 78.0 ksiTypical
 73.0 - 86.0 ksi
Tensile Strength, Yield 75.0 ksi0.2% Offset, Typical
 70.0 - 84.0 ksi0.2% Offset
Elongation at Break 5.0 %
Tensile Modulus 18130 ksi
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000570 ohm-cm30% IACS
 
Thermal PropertiesOriginal ValueComments
CTE, linear 9.50 µin/in-°F
@Temperature 20.0 - 100 °C
Thermal Conductivity 81.0 BTU-in/hr-ft²-°F
Melting Point 1882 - 1981 °F
Solidus 1882 °F
Liquidus 1981 °F
 
Component Elements PropertiesOriginal ValueComments
Copper, Cu 96.1 - 98.3 %As Balance
Iron, Fe <= 0.060 %
Lead, Pb <= 0.020 %
Manganese, Mn <= 0.020 %
Nickel, Ni 0.70 - 0.90 %
Phosphorus, P 0.020 - 0.090 %
Silicon, Si <= 0.010 %
Tin, Sn 1.0 - 2.0 %
Zinc, Zn <= 0.80 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC19040x2 / 291719

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