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Master Bond adhesives

Copper Alloy, UNS C19040, H04 Temper, Flat Products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Hard

Fabrication Properties: Excellent Suitability – Soldering, Brazing, Spot Weld, Seam Weld, Butt Weld; Good Suitability – Capacity for Being Cold Worked; Fair Suitability – Capacity for Being Hot Formed

Typical Uses: Automotive electrical terminals; Electrical and electronic terminals, connectors, Lead frames

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 8.89 g/cc0.321 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 538 MPa78000 psiTypical
 503 - 593 MPa73000 - 86000 psi
Tensile Strength, Yield 517 MPa75000 psi0.2% Offset, Typical
 483 - 579 MPa70000 - 84000 psi0.2% Offset
Elongation at Break 5.0 %5.0 %
Tensile Modulus 125.0 GPa18130 ksi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000570 ohm-cm0.00000570 ohm-cm30% IACS
 
Thermal PropertiesMetricEnglishComments
CTE, linear 17.1 µm/m-°C
@Temperature 20.0 - 100 °C
9.50 µin/in-°F
@Temperature 68.0 - 212 °F
Thermal Conductivity 11.7 W/m-K81.0 BTU-in/hr-ft²-°F
Melting Point 1028 - 1083 °C1882 - 1981 °F
Solidus 1028 °C1882 °F
Liquidus 1083 °C1981 °F
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu 96.1 - 98.3 %96.1 - 98.3 %As Balance
Iron, Fe <= 0.060 %<= 0.060 %
Lead, Pb <= 0.020 %<= 0.020 %
Manganese, Mn <= 0.020 %<= 0.020 %
Nickel, Ni 0.70 - 0.90 %0.70 - 0.90 %
Phosphorus, P 0.020 - 0.090 %0.020 - 0.090 %
Silicon, Si <= 0.010 %<= 0.010 %
Tin, Sn 1.0 - 2.0 %1.0 - 2.0 %
Zinc, Zn <= 0.80 %<= 0.80 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC19040x2 / 291719

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