Elantas Conap FR-2000 / FR-200 Conapoxy® Resin / Conacure® Hardener

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Elantas Conap FR-2000 / FR-200 Conapoxy® Resin / Conacure® Hardener
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries. Cytec (Conap) FR-2000 / FR-200 Conapoxy® Resin / Conacure® Hardener A filled system with superior acid resistance. Curing at room temperature or low elevated temperatures. Mix Ratio, Resin/Hardener (by weight): 100/26 Cure Type: Elevated Temperature Information provided by Cytec, subsequently acquired by Elantas.
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Physical Properties	Metric	English	Comments

Viscosity	300 cP @Temperature 25.0 °C	300 cP @Temperature 77.0 °F

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	90	90

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 3.60e+15 ohm-cm	<= 3.60e+15 ohm-cm
Dielectric Constant	4.07 @Frequency 1000 Hz	4.07 @Frequency 1000 Hz
Dielectric Strength	24.3 kV/mm	616 kV/in
Dissipation Factor	0.12 @Frequency 1000 Hz	0.12 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	130 °C	266 °F

Processing Properties	Metric	English	Comments
Cure Time	60.0 min @Temperature 47.0 °C	1.00 hour @Temperature 117 °F
Pot Life	40.0 min @Temperature 25.0 °C	40.0 min @Temperature 77.0 °F	100 grams

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PCYTEC56 / 29288

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