Parker Chomerics Tecknit Teckfip™ FIP-E (SP)` Formed in Place Conductive Elastomer

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Parker Chomerics Tecknit Teckfip™ FIP-E (SP)` Formed in Place Conductive Elastomer
Categories:	Polymer; Thermoset; Rubber or Thermoset Elastomer (TSE)
Material Notes:	This is the small particle version of the Ag/glass (FIP E) compound that was specifically designed for the mobile cell phone applications. It should be noted that this compound offers a low compression set, making it ideally suited to applications where by the gasket is frequently compressed and uncompressed. Information provided by Chomerics
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Physical Properties	Metric	English	Comments

Specific Gravity	1.53 - 2.07 g/cc	1.53 - 2.07 g/cc

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	60 - 80	60 - 80
Tensile Strength	>= 1.88 MPa	>= 273 psi
Elongation at Break	71 %	71 %
Peel Strength	>= 9.00 kN/m	>= 51.4 pli
Compression Set	10 - 25 %	10 - 25 %
	7.0 % @Temperature 70.0 °C, Time 79200 sec	7.0 % @Temperature 158 °F, Time 22.0 hour

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.0090 ohm-cm	0.0090 ohm-cm
Surface Resistance	<= 0.012 ohm	<= 0.012 ohm
	<= 0.012 ohm @Temperature 85.0 °C, Time 605000 sec	<= 0.012 ohm @Temperature 185 °F, Time 168 hour

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	125 °C	257 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Processing Properties	Metric	English	Comments
Cure Time	<= 1440 min	<= 24.0 hour
Tack-Free Time	>= 12.0 min	>= 0.200 hour
Shelf Life	1.00 Month	1.00 Month	Syringe
	6.00 Month	6.00 Month	Cartridge

Descriptive Properties
Color	Ivory
Filler	Silver/Glass

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PCHOME360 / 131070

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