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Master Bond adhesives

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Parker Chomerics Tecknit Teckfip™ FIP-E (SP)` Formed in Place Conductive Elastomer
Categories: Polymer; Thermoset; Rubber or Thermoset Elastomer (TSE)

Material Notes: This is the small particle version of the Ag/glass (FIP E) compound that was specifically designed for the mobile cell phone applications. It should be noted that this compound offers a low compression set, making it ideally suited to applications where by the gasket is frequently compressed and uncompressed.

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.53 - 2.07 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 60 - 80
Tensile Strength >= 273 psi
Elongation at Break 71 %
Peel Strength >= 9.00 kN/m
Compression Set 10 - 25 %
 7.0 %
@Temperature 70.0 °C,
Time 79200 sec
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 0.0090 ohm-cm
Surface Resistance <= 0.012 ohm
 <= 0.012 ohm
@Temperature 85.0 °C,
Time 605000 sec
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 125 °C
Minimum Service Temperature, Air -55.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time <= 24.0 hour
Tack-Free Time >= 0.200 hour
Shelf Life 1.00 MonthSyringe
 6.00 MonthCartridge
 
Descriptive Properties
ColorIvory
FillerSilver/Glass

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

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