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Elmet Technologies

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LG Chemical LUCON CP6052 PC/ABS+CNT  (discontinued **)
Categories: Polymer; Thermoplastic; ABS Polymer; Polycarbonate/ABS Alloy, Unreinforced; Polycarbonate (PC)

Material Notes: Description Injection Molding Grade, PC/ABS+CNT, Electrostatic Dissipation, Low Surface Resistivity, Improved Impact Strength

Application: Laser diode Tray, ATM parts, Telecommunication Station Housing,

CAS No. 103598-77-2, 9003-56-9, 181028-79-5 and 1333-86-4

Information provided by LG Chemical

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.24 g/ccASTM D792
Linear Mold Shrinkage, Flow 0.0040 - 0.0070 cm/cm
@Thickness 3.20 mm
ASTM D955
Melt Flow 7.0 g/10 min
@Load 10.0 kg,
Temperature 250 °C
ASTM D570
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Yield 650 kg(f)/cm²
@Thickness 3.20 mm
5mm/min; ASTM D638
Elongation at Break >= 10 %
@Thickness 3.20 mm
5mm/min; ASTM D638
Flexural Yield Strength 1000 kg(f)/cm²
@Thickness 6.40 mm
15mm/min; ASTM D790
Flexural Modulus 30000 kg(f)/cm²
@Thickness 6.40 mm
15mm/min; ASTM D790
Izod Impact, Notched 4.50 kg-cm/cm
@Thickness 3.20 mm,
Temperature 23.0 °C
ASTM D256
 
Electrical PropertiesOriginal ValueComments
Surface Resistance 10000 - 1.00e+7 ohmIEC 60093
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 0.46 MPa (66 psi) 117 °C
@Thickness 6.40 mm
ASTM D648
 
Processing PropertiesOriginal ValueComments
Rear Barrel Temperature 260 - 300 °CInjection Molding
Middle Barrel Temperature 270 - 310 °CInjection Molding
Front Barrel Temperature 270 - 310 °CInjection Molding
Nozzle Temperature 270 - 310 °CInjection Molding
Melt Temperature 270 - 310 °CInjection Molding
Mold Temperature 60.0 - 80.0 °CInjection Molding
Drying Temperature 70.0 - 80.0 °CInjection Molding
Dry Time 5.00 - 7.00 hourInjection Molding
Back Pressure 0.000 - 1.96 MPaInjection Molding
Screw Speed 40 - 60 rpmInjection Molding

**
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