CEN® Electronic Material CV Polyimide Film, 1 Mil Thickness

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CEN® Electronic Material CV Polyimide Film, 1 Mil Thickness
Categories:	Polymer; Film; Thermoset; Polyimide, TS; Polyimide, Thermoset Film
Material Notes:	CEN®CV polyimide film keeps the same film properties as CEN®CN polyimide film, and has an excellent balance of physical, chemical, and electrical properties over a wide temperature range. With superior dimensional stability at elevated temperatures, CEN®CV polyimide film is ideal for high temperature applications that require a low-shrinkage film. Applications: sensors, gaskets, electronic parts, pin grids, coverlay film, TAB tapes, reinforced board for FPC All information provided by CEN Electronic Material Co., LTD.
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Physical Properties	Metric	English	Comments

Thickness	22.0 - 28.0 microns	0.866 - 1.10 mil	ASTM D374

Mechanical Properties	Metric	English	Comments
Film Tensile Strength at Yield, MD	170 MPa	24700 psi	ASTM D882
Film Tensile Strength at Yield, TD	160 MPa	23200 psi	ASTM D882
Film Elongation at Yield, MD	>= 50 %	>= 50 %	ASTM D882
Film Elongation at Yield, TD	>= 55 %	>= 55 %	ASTM D882

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+14 ohm-cm	>= 1.00e+14 ohm-cm	ASTM D257
Surface Resistance	>= 1.00e+15 ohm	>= 1.00e+15 ohm	ASTM D257
Dielectric Strength	>= 200 kV/mm	>= 5080 kV/in	ASTM D149

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PCENE009 / 93471

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