Superior Flux Superior No. 99 Mildly Activated Rosin Flux, Type RMA

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RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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Superior Flux Superior No. 99 Mildly Activated Rosin Flux, Type RMA
Categories:	Metal; Nonferrous Metal; Solder/Braze Alloy
Material Notes:	A mildly activated rosin flux for general-purpose soldering of PCB's, wire, cable, and semiconductors, and hand soldering applications. Excellent for a variety of metals including copper, gold, nickel alloys, silver, and tin. Can be used for automated and manual soldering operations. Flux conforms to IPC-ANSI-J-STD-004, Type ROL1. Description: Superior No. 99 RMA Flux consists of a homogeneous solution of water-white rosin in a multi-component solvent system with a brominated organic activator. It is completely chloride-free. The flux is widely used in electronic applications requiring excellent soldering activity and yielding residues with high water-extract resistivities. Superior No. 99 RMA Flux becomes active above 175°C/340°F, attaining peak activity in the temperature range 200-260°C/390-500°F, where it promotes excellent solderability. It can also be used for high-temperature soldering applications, such as mag-wire tinning at temperatures in the 400-430°C/750-800°F range. Applications: Superior No. 99 RMA Flux is an excellent choice for soldering printed circuit boards (PCBs), wire leads, cables, and component tinning. Superior No. 99 RMA Flux can be used to solder many different metals and alloys including copper, gold, alloy 42, alloy 51, nickel alloys, and other metals commonly used in electronics applications. Information provided by Superior Flux
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Physical Properties	Original Value	Comments

Specific Gravity	0.880 - 0.920 g/cc
Density	7.50 lb/gal
Solids Content	43.5 - 47.5 %

Thermal Properties	Original Value	Comments
Boiling Point	82.3 °C
Flash Point	12.0 °C	TCC Method

Processing Properties	Original Value	Comments
Processing Temperature	200 - 260 °C	Soldering Range
Shelf Life	2.00 Month

Descriptive Properties
Form	Light Brown Liquid
Residues	Non-Corrosive, Non-Conductive
Spread Factor	>90
Water Extract Resistivity	150000 ohm/cm

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NSFLUX040 / 185724

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