Thermal Ceramics TE 1200 Board and Shapes Molded Min-K Insulation

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Thermal Ceramics TE 1200 Board and Shapes Molded Min-K Insulation
Categories:	Ceramic
Material Notes:	Min-K TE 1200 can be used in contact with lead-telluride thermoelectric devices. The fibrous component of the material allows TE 1200 to be direct molded into fairly intricate shapes. Features: Microporous Low thermal conductivity Compression resistant Machined to customer specification Lightweight Organic Applications: Aerospace High temperature Thermoelectric devices Instrumentation and analytical equipment Information provided by Thermal Ceramics Data has not been recently verified. Please contact manufacturer for current information.
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Physical Properties	Metric	English	Comments

Density	0.320 g/cc	0.0116 lb/in³

Mechanical Properties	Metric	English	Comments
Transverse Strength	>= 0.241 MPa	>= 35.0 psi
Compressive Yield Strength	0.689 MPa	100 psi	5% compression
	1.17 MPa	170 psi	8% compression

Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.0288 W/m-K @Temperature 149 °C	0.200 BTU-in/hr-ft²-°F @Temperature 300 °F
	0.0288 W/m-K @Temperature 204 °C	0.200 BTU-in/hr-ft²-°F @Temperature 400 °F
	0.0303 W/m-K @Temperature 316 °C	0.210 BTU-in/hr-ft²-°F @Temperature 600 °F
	0.0331 W/m-K @Temperature 427 °C	0.230 BTU-in/hr-ft²-°F @Temperature 800 °F
	0.0360 W/m-K @Temperature 538 °C	0.250 BTU-in/hr-ft²-°F @Temperature 1000 °F
	0.0432 W/m-K @Temperature 649 °C	0.300 BTU-in/hr-ft²-°F @Temperature 1200 °F
Maximum Service Temperature, Air	649 °C	1200 °F

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CTHERM208 / 2528

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