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Thermal Ceramics TE 1200 Board and Shapes Molded Min-K Insulation
Categories: Ceramic

Material Notes: Min-K TE 1200 can be used in contact with lead-telluride thermoelectric devices. The fibrous component of the material allows TE 1200 to be direct molded into fairly intricate shapes.

Features:

  • Microporous
  • Low thermal conductivity
  • Compression resistant
  • Machined to customer specification
  • Lightweight
  • Organic
  • Applications:

  • Aerospace
  • High temperature
  • Thermoelectric devices
  • Instrumentation and analytical equipment
  • Information provided by Thermal Ceramics

    Data has not been recently verified. Please contact manufacturer for current information.

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    Physical PropertiesOriginal ValueComments
    Density 0.320 g/cc
     
    Mechanical PropertiesOriginal ValueComments
    Transverse Strength >= 35.0 psi
    Compressive Yield Strength 0.689 MPa5% compression
     1.17 MPa8% compression
     
    Thermal PropertiesOriginal ValueComments
    Thermal Conductivity 0.200 BTU-in/hr-ft²-°F
    @Temperature 149 °C
     0.200 BTU-in/hr-ft²-°F
    @Temperature 204 °C
     0.210 BTU-in/hr-ft²-°F
    @Temperature 316 °C
     0.230 BTU-in/hr-ft²-°F
    @Temperature 427 °C
     0.250 BTU-in/hr-ft²-°F
    @Temperature 538 °C
     0.300 BTU-in/hr-ft²-°F
    @Temperature 649 °C
    Maximum Service Temperature, Air 1200 °F

    Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

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    CTHERM208 / 2528

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