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Master Bond adhesives

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Sumitomo Bakelite North America 52-20-30 Short-Glass Reinforced Diallyl Phthalate
Categories: Polymer; Thermoset; Diallyl Phthalate (DAP); Diallyl Phthalate (DAP) Molding Compound, Short Glass Fiber Filled; Filled/Reinforced Thermoset

Material Notes: Ortho Resin Isomer (DAP). Used for critical, high-performance military and commercial electrical components where long-term reliability is demanded.

Information provided by Sumitomo Bakelite North America, Inc.

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Physical PropertiesOriginal ValueComments
Density 1.72 g/ccASTM D792
Apparent Bulk Density 0.290 g/cc
Water Absorption 0.35 %48 hours, 50°C. ASTM D570
Linear Mold Shrinkage 0.0015 - 0.0035 cm/cmCompression Molding. ASTM D955
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Ultimate 69.0 MPaASTM D638
Flexural Yield Strength 131 MPaASTM D790
Flexural Modulus 13.8 GPaASTM D790
Compressive Yield Strength 152 MPaASTM D695
Izod Impact, Notched 1.87 J/cmASTM D256A
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 4.2
@Frequency 1e+6 Hz
Wet
 4.4
@Frequency 1000 Hz
Wet
Dielectric Strength 14.0 kV/mmWet, step-by-step. ASTM D149
 15.0 kV/mmWet, short term. ASTM D149
Dissipation Factor 0.010
@Frequency 1000 Hz
Wet; ASTM D150
 0.016
@Frequency 1e+6 Hz
Wet; ASTM D150
Arc Resistance 130 secASTM D495
Comparative Tracking Index >= 600 VUL746A, ASTM D3638
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 21.0 µm/m-°C
@Temperature 20.0 °C
ASTM D696
Thermal Conductivity 0.306 W/m-KASTM F433
Deflection Temperature at 1.8 MPa (264 psi) 260 °CASTM D648A
Oxygen Index 21 %ASTM D2863
 
Processing PropertiesOriginal ValueComments
Processing Temperature 160 - 180 °CMold temperature

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