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Master Bond adhesives

Sumitomo Bakelite North America 52-20-30 Short-Glass Reinforced Diallyl Phthalate
Categories: Polymer; Thermoset; Diallyl Phthalate (DAP); Diallyl Phthalate (DAP) Molding Compound, Short Glass Fiber Filled; Filled/Reinforced Thermoset

Material Notes: Ortho Resin Isomer (DAP). Used for critical, high-performance military and commercial electrical components where long-term reliability is demanded.

Information provided by Sumitomo Bakelite North America, Inc.

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Physical PropertiesMetricEnglishComments
Density 1.72 g/cc0.0621 lb/in³ASTM D792
Apparent Bulk Density 0.290 g/cc0.0105 lb/in³
Water Absorption 0.35 %0.35 %48 hours, 50°C. ASTM D570
Linear Mold Shrinkage 0.0015 - 0.0035 cm/cm0.0015 - 0.0035 in/inCompression Molding. ASTM D955
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Ultimate 69.0 MPa10000 psiASTM D638
Flexural Yield Strength 131 MPa19000 psiASTM D790
Flexural Modulus 13.8 GPa2000 ksiASTM D790
Compressive Yield Strength 152 MPa22000 psiASTM D695
Izod Impact, Notched 1.87 J/cm3.50 ft-lb/inASTM D256A
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant  4.2
@Frequency 1e+6 Hz
4.2
@Frequency 1e+6 Hz
Wet
 4.4
@Frequency 1000 Hz
4.4
@Frequency 1000 Hz
Wet
Dielectric Strength 14.0 kV/mm356 kV/inWet, step-by-step. ASTM D149
 15.0 kV/mm381 kV/inWet, short term. ASTM D149
Dissipation Factor  0.010
@Frequency 1000 Hz
0.010
@Frequency 1000 Hz
Wet; ASTM D150
 0.016
@Frequency 1e+6 Hz
0.016
@Frequency 1e+6 Hz
Wet; ASTM D150
Arc Resistance 130 sec130 secASTM D495
Comparative Tracking Index >= 600 V>= 600 VUL746A, ASTM D3638
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 21.0 µm/m-°C
@Temperature 20.0 °C
11.7 µin/in-°F
@Temperature 68.0 °F
ASTM D696
Thermal Conductivity 0.306 W/m-K2.12 BTU-in/hr-ft²-°FASTM F433
Deflection Temperature at 1.8 MPa (264 psi) 260 °C500 °FASTM D648A
Oxygen Index 21 %21 %ASTM D2863
 
Processing PropertiesMetricEnglishComments
Processing Temperature 160 - 180 °C320 - 356 °FMold temperature

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