Cookson Group Plaskon® SMT-B-1 LAS (146.408) Epoxy Molding Compound for PBGAs

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Cookson Group Plaskon® SMT-B-1 LAS (146.408) Epoxy Molding Compound for PBGAs (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. An epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It is formulated with a unique resin system which minimizes warpage and enables trouble-free molding onto laminated substrates. Minimal warpage (after post bake and solder treatment); Outstanding high temperature flexural strength; Low stress; Excellent moldability (low viscosity); Low alpha particle count
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Density	1.88 g/cc	0.0679 lb/in³
Viscosity	45000 cP @Temperature 175 °C	45000 cP @Temperature 347 °F	Automatic orifice Viscosity
Spiral Flow	140 cm	55.1 in	175°C/1000 psi

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	75	75
Flexural Strength	103 MPa	14900 psi
Flexural Modulus	14.0 GPa	2030 ksi

Electrical Properties	Metric	English	Comments
Electrical Resistivity	>= 1.00e+15 ohm-cm	>= 1.00e+15 ohm-cm
Dielectric Constant	3.7 @Frequency 1000 Hz	3.7 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm	406 kV/in
Dissipation Factor	0.0021 @Frequency 1000 Hz	0.0021 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	16.0 µm/m-°C @Temperature 20.0 °C	8.89 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	68.0 µm/m-°C @Temperature 20.0 °C	37.8 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	220 °C	428 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Processing Properties	Metric	English	Comments
Processing Temperature	170 - 185 °C	338 - 365 °F	Molding temperature

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

Users of our Advanced Search (registration required) may exclude discontinued materials from search results.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Cookson Group Plaskon® SMT-B-1RC (146.403) Epoxy Molding Compound for PBGAs
TIMCAL TIMREX® M80 mesh FR Natural Flake Graphite
Overview of materials for Epoxy, Thermally Conductive
Overview of materials for Epoxy, High Temperature
NeoGraf eGRAF® HITHERM™ HT-2510 Graphite with Polymer Additive

PCOOK334 / 21430

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message