Cookson Group Plaskon® SMT-B-1 LAS (146.408) Epoxy Molding Compound for PBGAs

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Cookson Group Plaskon® SMT-B-1 LAS (146.408) Epoxy Molding Compound for PBGAs (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. An epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It is formulated with a unique resin system which minimizes warpage and enables trouble-free molding onto laminated substrates. Minimal warpage (after post bake and solder treatment); Outstanding high temperature flexural strength; Low stress; Excellent moldability (low viscosity); Low alpha particle count
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Physical Properties	Original Value	Comments

Density	1.88 g/cc
Viscosity	45000 cP @Temperature 175 °C	Automatic orifice Viscosity
Spiral Flow	140 cm	175°C/1000 psi

Mechanical Properties	Original Value	Comments
Hardness, Shore D	75
Flexural Strength	103 MPa
Flexural Modulus	14.0 GPa

Electrical Properties	Original Value	Comments
Electrical Resistivity	>= 1.00e+15 ohm-cm
Dielectric Constant	3.7 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm
Dissipation Factor	0.0021 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	16.0 µm/m-°C @Temperature 20.0 °C
CTE, linear, Transverse to Flow	68.0 µm/m-°C @Temperature 20.0 °C
Thermal Conductivity	0.700 W/m-K
Glass Transition Temp, Tg	220 °C
Flammability, UL94	V-0 @Thickness 3.20 mm
	V-0 @Thickness 3.20 mm

Processing Properties	Original Value	Comments
Processing Temperature	170 - 185 °C	Molding temperature

**
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PCOOK334 / 21430

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