Hapco DI-PAK™ R-4525/30 Potting and Encapsulating Compound

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Hapco DI-PAK™ R-4525/30 Potting and Encapsulating Compound
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	A general purpose series of low viscosity, strong, potting and encapsulating compounds. DI-PAK™ R-4525 has excellent electrical insulating properties and bonds well to many substrates. By varying the curing agents, the desired cure and working life can be obtained. Information provided by Hapco, Inc.
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Physical Properties	Original Value	Comments

Specific Gravity	1.45 g/cc	ASTM D-4669
Viscosity	1150 cP	ASTM D-4878
Linear Mold Shrinkage	0.00050 - 0.0025 in/in	ASTM D-2566

Mechanical Properties	Original Value	Comments
Hardness, Shore D	92	ASTM D-2240
Tensile Strength	7700 psi	ASTM D-638
Elongation at Break	0.80 %	ASTM D-638
Modulus of Elasticity	410 ksi	ASTM D-638
Flexural Strength	8600 psi	ASTM D-790
Flexural Modulus	436 ksi	ASTM D-790
Izod Impact, Notched	0.430 ft-lb/in	ASTM D-256
Izod Impact, Unnotched	0.640 ft-lb/in	ASTM D-256

Electrical Properties	Original Value	Comments
Volume Resistivity	1.20e+14 ohm-cm	ASTM D-270
Dielectric Constant	4.2 @Frequency 100000 Hz	ASTM D-150
	4.4 @Frequency 1000 Hz	ASTM D-150
Dielectric Strength	630 V/mil	ASTM D-149
Dissipation Factor	0.0038 @Frequency 100000 Hz	ASTM D-150

Thermal Properties	Original Value	Comments
Thermal Conductivity	2.90 BTU-in/hr-ft²-°F
Maximum Service Temperature, Inert	175 °C

Processing Properties	Original Value	Comments
Cure Time	2.00 - 4.00 hour @Thickness 3.17 mm, Temperature 57.2 °C	Demold
	2.00 - 4.00 hour @Thickness 3.17 mm, Temperature 93.3 °C	Demold
Gel Time	60.0 - 90.0 min @Load 0.100 kg	ASTM D-2971

Descriptive Properties
Color (cured)	Black
Mix Ratio	100:15	Weight
	100:25	Volume

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PHAPCO035 / 317094

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