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Master Bond adhesives

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Kohesi Bond KB 1040 Two component, room temperature curing clear epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy Adhesive; Epoxy Encapsulant, Unreinforced

Material Notes: Product Highlights:
  • Phenomenal optical clarity
  • Excellent flow properties
  • Outstanding adhesion to various substrates
  • Very low shrinkage post curing
  • Exceptional electrical insulation
  • Stellar dimensional stability
Kohesi Bond KB 1040 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This epoxy system offers excellent adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 1 - 2 hours. KB 1040 is optically clear and offers top notch light transmissions properties. It has a refractive index of 1.57. It offers an extensive service temperature range of -50°C to +120°C. This adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure. This makes it suitable for gap filling applications. It also offers excellent chemical resistance to a variety of fuels, oils, acids, bases and water. Part A is clear in color and Part B is light straw in color. KB 1040 is widely used in optical, optoelectronic, fiber-optic, electronics, aerospace and related industries especially when optical clarity is desirable.

Typical Applications:

  • Bonding
  • Sealing
  • Coating
  • Potting
  • Encapsulation

Information provided by Kohesi Bond Custom Engineered Adhesives

Vendors: Kohesi Bond is a pioneer in manufacturing over 300 grades of custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. Our first-rate adhesives are tailor-fitted to meet your exact specifications and offer superior strength and performance in your application. Learn more about Kohesi Bond’s industry-ready products at kohesibond.com.

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Physical PropertiesOriginal ValueComments
Viscosity 250 - 500 cPPart B
 400 - 1000 cPPart A
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D >= 75
Tensile Strength >= 10000 psi
Tensile Modulus >= 410000 psi
Adhesive Bond Strength >= 3200 psiTensile Lap Shear, Al/Al
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+15 ohm-cm
Dielectric Constant 3.56
@Frequency 60 Hz
Dielectric Strength 440 V/mil
@Thickness 3.17 mm
Dissipation Factor 0.0050
@Frequency 60 Hz
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 120 °C
Minimum Service Temperature, Air -50.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 - 3.00 hour
@Temperature 90.0 °C
Option 2
 24.0 - 48.0 hour
@Temperature 23.0 °C
Option 1
Working Life 25.0 - 40.0 min100 g of mixed epoxy
Shelf Life 12.0 Monthin original unopened containers
 
Descriptive Properties
Mixing Ratio4:1 by weightPart A : Part B

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PKOHESI920 / 249099

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