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Master Bond adhesives

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IIMAK METALLOGRAPH™ IINK-SSX Conductive Ink
Categories: Other Engineering Material; Ceramic/Metallic Coating

Material Notes: This electrically conductive screen ink has been developed for use in printed electronics, notably for membrane switches, flexible circuits, electroluminescent lighting and other applications requiring fine line features. This product features market-leading dry times and temperatures and has excellent flexibility and adhesion to a variety of substrates.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 4.43 g/cc
Solids Content 62 - 63 %
Filler Content 53.25 - 53.75 %Silver (Ag)
Particle Size 6.0 µm
Viscosity 49000 - 51000 cP
Thickness 1.00 - 10.0 microns
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 0.000052 - 0.000057 ohm-cm
Surface Resistivity per Square 0.015 - 0.045 ohm
 
Optical PropertiesOriginal ValueComments
Transmission, Visible 0.00 %
 
Processing PropertiesOriginal ValueComments
Cure Time 120 - 420 sec
 
Descriptive Properties
Adhesion5
Binder SystemProprietary
Conductive Filler TypeSilver (Ag)
Material TypeReady-To-Use Formulation
Solvent Systemglycol ethers

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PFLEXCM30 / 179432

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