Tosoh S Fused Silica Glass

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Tosoh S Fused Silica Glass
Categories:	Ceramic; Glass
Material Notes:	Tosoh S material is manufactured by fusing a synthetic super high-purity silica powder using Tosoh’s proprietary oxy-hydrogen flame fusion process. Tosoh SD material is fused from the same synthetic super high-purity powder using a plasma fusion process for reduced OH content. Thanks to their extreme purity and complete lack of inclusions, S and SD materials are the next generation of materials for semiconductor manufacturing. Available in up to 1,200mm square ingots, S and SD materials are 450mm wafer ready. Information provided by Tosh Corporation
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Physical Properties	Original Value	Comments

Density	2.20 g/cc
Viscosity	12500 cP @Temperature 1200 °C

Mechanical Properties	Original Value	Comments
Hardness, Vickers	907.5
Tensile Strength	50.0 MPa
Modulus of Elasticity	74.0 GPa	Young's
Flexural Strength	65.0 - 95.0 MPa
Compressive Strength	1.13 MPa
Poissons Ratio	0.17
Shear Modulus	31.0 GPa
Torsional Stiffness	29.0 MPa

Electrical Properties	Original Value	Comments
Volume Resistivity	7.00e+16 ohm-cm
Surface Resistance	4.00e+15 ohm
Dielectric Constant	3.9 @Frequency 5.00e+8 Hz
Dielectric Strength	32.0 kV/mm @Frequency 50 Hz
Dielectric Loss Index	<= 1.0 @Frequency 5.00e+8 Hz

Thermal Properties	Original Value	Comments
CTE, linear	0.570 µm/m-°C @Temperature 30.0 - 600 °C
Specific Heat Capacity	0.749 J/g-°C
Thermal Conductivity	1.38 W/m-K
Softening Point	1720 °C	(?=107.6)*2
Annealing Point	1170 °C	(?=1013)
Strain Point	1070 °C	(?=1014.5)

Descriptive Properties
Chemical Properties	? 0.01ppm	Cu
	? 0.01ppm	K
	? 0.01ppm	Li
	? 0.01ppm	Mg
	0 ppm	Ca
	0.05 ppm	Fe
	0.18 ppm	Na
	1.6 ppm	Al
	350 ppm	OH

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PTOSOH011 / 306466

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