Tosoh S material is manufactured by fusing a synthetic super high-purity silica powder using Tosoh’s proprietary oxy-hydrogen flame fusion process. Tosoh SD material is fused from the same synthetic super high-purity powder using a plasma fusion process for reduced OH content. Thanks to their extreme purity and complete lack of inclusions, S and SD materials are the next generation of materials for semiconductor manufacturing. Available in up to 1,200mm square ingots, S and SD materials are 450mm wafer ready.Information provided by Tosh Corporation |