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Chemically Resistant adhesives

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Parker Chomerics THERM-A-GAP™ TS15 Thermally Conductive Gap Filler Pad
Categories: Polymer; Thermoset; Silicone

Material Notes: Description: THERM-A-GAP™ TS15 is designed to provide excellent mechanical integrity in applications where clamping forces exert extreme pressure on parts and where gaps are thicker than what is typical of dielectric pads.

Product Features: Increased tear resistance eliminates dielectric failures by preventing puncture from sharp components and Thermal performance decreases electronic component temperatures, increasing product lifetimes

Product Attributes: Good thermal conductivity; Excellent mechanical strength and Excellent cut-through resistance.

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.20 g/ccASTM D792
Thickness 1000 - 5000 micronsASTM D374
Deformation 3.0 %
@Diameter 12.7 mm,
Pressure 0.0345 MPa
0.025 in/min rate; ASTM C165 MOD
 5.0 %
@Diameter 12.7 mm,
Pressure 0.0689 MPa
0.025 in/min rate; ASTM C165 MOD
 7.0 %
@Diameter 12.7 mm,
Pressure 0.172 MPa
0.025 in/min rate; ASTM C165 MOD
 9.0 %
@Diameter 12.7 mm,
Pressure 0.345 MPa
0.025 in/min rate; ASTM C165 MOD
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 50ASTM D2240
Tensile Strength 250 psiASTM D412
Elongation at Break 20 %ASTM D412
Tear Strength 40.0 pliASTM D624
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+14 ohm-cmASTM D257
Dielectric Constant 6.5
@Frequency 1e+6 Hz
ASTM D150
Dielectric Strength 8.00 kV/mmASTM D149
Dissipation Factor 0.013
@Frequency 1e+6 Hz
Chomerics
 
Thermal PropertiesOriginal ValueComments
CTE, linear 250 µm/m-°CASTM E831
Specific Heat Capacity 1.00 J/g-°CASTM D1269
Thermal Conductivity 1.50 W/m-KASTM D5470
 
Processing PropertiesOriginal ValueComments
Shelf Life 18.0 MonthFrom date of manufacture; Chomerics
 
Descriptive Properties
CarrierFiberglass reinforced dielectric layer with PSA
ColorTeal/Blue

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Chemically Resistant adhesives

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