Park Aerospace Nelco® N7000-2 HT/N7000-3 Toughened Polyimide Laminate and Prepreg

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

(Viewing data as-entered. Click here to return)

Park Aerospace Nelco® N7000-2 HT/N7000-3 Toughened Polyimide Laminate and Prepreg
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	The Nelco N7000-2 HT laminate and N7000-3 prepreg are a series of toughened polyimide materials for use in high-reliability multilayers. This combined resin system provides excellent thermal performance, improved processing characteristics and is exceptional for use in a wide variety of applications that include fine geometry multilayer constructions and extreme reliability requirements. Key Features and Benefits: Polyimide resin chemistry Lead-free assembly compatibility Supports current and previous military and industrial standards Reliable plated-through holes Reliable processing Applications/Qualifications: Fine-Line Multilayers Backplanes Surface-Mount Multilayers BGA Multilayers Direct Chip Attach Underhood Automotive Burn-in Boards Information provided by Park Electrochemical Corp.
Key Words:	PI
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Original Value	Comments

Density	1.70 g/cc	50% Resin Content; Internal Method
Water Absorption	0.35 %	IPC-TM-650.2.6.2.1

Mechanical Properties	Original Value	Comments
Modulus of Elasticity	3100 ksi	X; ASTM D3039
	3300 ksi	Y; ASTM D3039
Poissons Ratio	0.146	X; ASTM D3039
	0.153	Y; ASTM D3039
Peel Strength	7.00 pli	at elevated temperature; IPC-TM-650.2.4.8.2a
	7.00 pli	after exposure to process solutions; IPC-TM-650.2.4.8
	7.50 pli	after solder float; IPC-TM-650.2.4.8

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+13 ohm-cm	C - 96/35/90; IPC-TM-650.2.5.17.1
	1.00e+13 ohm-cm	E - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance	1.00e+13 ohm	C - 96/35/90; IPC-TM-650.2.5.17.1
	1.00e+13 ohm	E - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant	3.5 @Frequency 2.50e+9 Hz	Stripline; IPC-TM-650.2.5.5.5
	3.5 @Frequency 1e+10 Hz	Stripline; IPC-TM-650.2.5.5.5
	3.5 @Frequency 1e+10 Hz	Split Post Cavity
	3.8 @Frequency 1e+9 Hz	RF Impedance; IPC-TM-650.2.5.5.9
Dielectric Strength	1200 V/mil	IPC-TM-650.2.5.6.2
Dielectric Breakdown	>= 50000 V	IPC-TM-650.2.5.6
Dissipation Factor	0.0090 @Frequency 1e+10 Hz	Split Post Cavity
	0.015 @Frequency 2.50e+9 Hz	Stripline; IPC-TM-650.2.5.5.5
	0.015 @Frequency 1e+10 Hz	Stripline; IPC-TM-650.2.5.5.5
Arc Resistance	100 sec	IPC-TM-650.2.5.1

Thermal Properties	Original Value	Comments
CTE, linear	5.00 - 6.67 µin/in-°F @Temperature -40.0 - 125 °C	IPC-TM-650.2.4.41
Specific Heat Capacity	0.250 BTU/lb-°F	ASTM E1461
Thermal Conductivity	3.12 BTU-in/hr-ft²-°F	ASTM E1461
Glass Transition Temp, Tg	250 °C	TMA; IPC-TM-650.2.4.24c
	260 °C	DSC; IPC-TM-650.2.4.25c
Decomposition Temperature	376 °C	5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94	V-0

Descriptive Properties
Methylene Chloride Resistance (% Weight Change)	<0.50	IPC-TM-650.2.3.4.3
Pressure Cooker	Pass	60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)	12+	IPC-TM-650.2.4.24.1
Z Axis Expansion (%)	<2.5	50ºC to 260ºC; IPC-TM-650.2.4.41

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Park Aerospace Nelco® N7000-1 Polyimide Laminate and Prepreg
Park Aerospace Nelco® N7000-2 V0 Toughened Polyimide Laminate and Prepreg
Hippe PI
Ensinger TECASINT™ 2021 Polyimide, Brown (PI)
Ensinger TECASINT 4211 SD Polyimide, Black, Carbon Fiber (PI)

PPARK122 / 89394

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message