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Specialty Compounds RTP Company

Park Aerospace Nelco® N7000-2 HT/N7000-3 Toughened Polyimide Laminate and Prepreg
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: The Nelco N7000-2 HT laminate and N7000-3 prepreg are a series of toughened polyimide materials for use in high-reliability multilayers. This combined resin system provides excellent thermal performance, improved processing characteristics and is exceptional for use in a wide variety of applications that include fine geometry multilayer constructions and extreme reliability requirements.

Key Features and Benefits:

  • Polyimide resin chemistry
  • Lead-free assembly compatibility
  • Supports current and previous military and industrial standards
  • Reliable plated-through holes
  • Reliable processing

Applications/Qualifications:

  • Fine-Line Multilayers
  • Backplanes
  • Surface-Mount Multilayers
  • BGA Multilayers
  • Direct Chip Attach
  • Underhood Automotive
  • Burn-in Boards

Information provided by Park Electrochemical Corp.

Key Words: PI
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.70 g/cc0.0614 lb/in³50% Resin Content; Internal Method
Water Absorption 0.35 %0.35 %IPC-TM-650.2.6.2.1
 
Mechanical PropertiesMetricEnglishComments
Modulus of Elasticity 21.4 GPa3100 ksiX; ASTM D3039
 22.8 GPa3300 ksiY; ASTM D3039
Poissons Ratio 0.1460.146X; ASTM D3039
 0.1530.153Y; ASTM D3039
Peel Strength 1.23 kN/m7.00 pliat elevated temperature; IPC-TM-650.2.4.8.2a
 1.23 kN/m7.00 pliafter exposure to process solutions; IPC-TM-650.2.4.8
 1.31 kN/m7.50 pliafter solder float; IPC-TM-650.2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+13 ohm-cm1.00e+13 ohm-cmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+13 ohm-cm1.00e+13 ohm-cmE - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+13 ohm1.00e+13 ohmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+13 ohm1.00e+13 ohmE - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant  3.5
@Frequency 2.50e+9 Hz
3.5
@Frequency 2.50e+9 Hz
Stripline; IPC-TM-650.2.5.5.5
 3.5
@Frequency 1e+10 Hz
3.5
@Frequency 1e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
 3.5
@Frequency 1e+10 Hz
3.5
@Frequency 1e+10 Hz
Split Post Cavity
 3.8
@Frequency 1e+9 Hz
3.8
@Frequency 1e+9 Hz
RF Impedance; IPC-TM-650.2.5.5.9
Dielectric Strength 47.2 kV/mm1200 kV/inIPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 V>= 50000 VIPC-TM-650.2.5.6
Dissipation Factor  0.0090
@Frequency 1e+10 Hz
0.0090
@Frequency 1e+10 Hz
Split Post Cavity
 0.015
@Frequency 2.50e+9 Hz
0.015
@Frequency 2.50e+9 Hz
Stripline; IPC-TM-650.2.5.5.5
 0.015
@Frequency 1e+10 Hz
0.015
@Frequency 1e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
Arc Resistance 100 sec100 secIPC-TM-650.2.5.1
 
Thermal PropertiesMetricEnglishComments
CTE, linear 9.00 - 12.0 µm/m-°C
@Temperature -40.0 - 125 °C
5.00 - 6.67 µin/in-°F
@Temperature -40.0 - 257 °F
IPC-TM-650.2.4.41
Specific Heat Capacity 1.05 J/g-°C0.250 BTU/lb-°FASTM E1461
Thermal Conductivity 0.450 W/m-K3.12 BTU-in/hr-ft²-°FASTM E1461
Glass Transition Temp, Tg 250 °C482 °FTMA; IPC-TM-650.2.4.24c
 260 °C500 °FDSC; IPC-TM-650.2.4.25c
Decomposition Temperature 376 °C709 °F5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0V-0
 
Descriptive Properties
Methylene Chloride Resistance (% Weight Change)<0.50IPC-TM-650.2.3.4.3
Pressure CookerPass60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)12+IPC-TM-650.2.4.24.1
Z Axis Expansion (%)<2.550ºC to 260ºC; IPC-TM-650.2.4.41

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