Henkel Loctite® ABLESTIK 8006NS Epoxy

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Henkel Loctite® ABLESTIK 8006NS Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: White Product Benefits: B-Stageable Non-conductive Offers improved printability Engineered to accurately control bondline thickness and die tilt Cure: Heat cure Application: Die attach Filler Type: Alumina/Silica LOCTITE ABLESTIK 8006NS non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This product is designed for application by stencil or screen printing. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. Once B-staged, this adhesive remains stable and can be placed into storage for several months. With proper die bonder setup along with incorporating adequate die placement pressure, a consistent minimum bondline thickness of 1mil can be achieved with minimal die tilt. Information provided by Loctite®
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Physical Properties	Metric	English	Comments

Brookfield Viscosity	55000 cP	55000 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Metric	English	Comments
Tensile Modulus	0.0697 GPa @Temperature 250 °C	10.1 ksi @Temperature 482 °F	Cured, DMTA
	1.196 GPa @Temperature 150 °C	173.5 ksi @Temperature 302 °F	Cured, DMTA
	4.376 GPa @Temperature 25.0 °C	634.7 ksi @Temperature 77.0 °F	Cured, DMTA
	5.908 GPa @Temperature -65.0 °C	856.9 ksi @Temperature -85.0 °F	Cured, DMTA

Electrical Properties	Metric	English	Comments
Volume Resistivity	4.30e+13 ohm-cm	4.30e+13 ohm-cm
Dielectric Strength	28.7 kV/mm	729 kV/in

Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.440 W/m-K	3.05 BTU-in/hr-ft²-°F	Cured

Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 175 °C	0.500 hour @Temperature 347 °F	Alternate Cure Schedule
	120 min @Temperature 160 °C	2.00 hour @Temperature 320 °F
Working Life	>= 1440 min	>= 1440 min
Shelf Life	12.0 Month @Temperature -40.0 °C	12.0 Month @Temperature -40.0 °F	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10		Cured, Sodium (Na+)
	<10		Cured, Potassium (K+)
	<15		Cured, Chloride (Cl-)
Shear Strength	23 kg-f		Die, 2 x 2 mm Si die on ceramic @ 245ºC
Thixotropic Index	1.3		Uncured, 0.5/5 rpm

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PLOCT5022 / 255233

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