Envalior ForTii® NMX33LD (P1133FD50) PPA-GF50 PA4T High Temperature Polyamide

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Envalior ForTii® NMX33LD (P1133FD50) PPA-GF50 PA4T High Temperature Polyamide
Categories:	Polymer; Thermoplastic; Polyphthalamide (PPA); Polyphthalamide (PPA), 50% Glass Fiber Reinforced
Material Notes:	ForTii® is a high temperature polyamide for applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries. ForTii® NMX33LD has superior mechanical performance and has excellent hybrid bonding performance. NMX33LD has a low Dk, making and is suitable for structural parts in devices such as mobile phones. Features: 50% glass reinforced. Processing: Injection molding. Former DSM Engineering Plastics product line is now with Envalior.
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Physical Properties	Original Value	Comments

Density	1.56 g/cc	Dry; ISO 1183
Moisture Absorption	1.60 %	Dry; Sim. to ISO 62
Linear Mold Shrinkage, Flow	0.0020 cm/cm	Dry; ISO 294-4
Linear Mold Shrinkage, Transverse	0.0070 cm/cm	Dry; ISO 294-4

Mechanical Properties	Original Value	Comments
Tensile Strength at Break	260 MPa	Dry; ISO 527-1/-2
Elongation at Break	2.5 %	Dry; ISO 527-1/-2
Tensile Modulus	16000 MPa	Dry; ISO 527-1/-2
Charpy Impact, Notched	18.0 kJ/m² @Temperature 23.0 °C	Dry; ISO 179/1eA

Electrical Properties	Original Value	Comments
Dielectric Constant	3.8 @Frequency 1e+9 Hz	Dry; IEC 60250

Thermal Properties	Original Value	Comments
Melting Point	315 °C	10°C/min. Dry; ISO 11357-1/-3
Deflection Temperature at 1.8 MPa (264 psi)	245 °C	Dry; ISO 75-1/-2
UL RTI, Electrical	85.0 °C @Thickness 0.750 mm	UL746B
Flammability, UL94	HB @Thickness 3.00 mm	Dry; IEC 60695-11-10

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PDSM7934 / 291370

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