Envalior ForTii® NMX33LD (P1133FD50) PPA-GF50 PA4T High Temperature Polyamide

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Envalior ForTii® NMX33LD (P1133FD50) PPA-GF50 PA4T High Temperature Polyamide
Categories:	Polymer; Thermoplastic; Polyphthalamide (PPA); Polyphthalamide (PPA), 50% Glass Fiber Reinforced
Material Notes:	ForTii® is a high temperature polyamide for applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries. ForTii® NMX33LD has superior mechanical performance and has excellent hybrid bonding performance. NMX33LD has a low Dk, making and is suitable for structural parts in devices such as mobile phones. Features: 50% glass reinforced. Processing: Injection molding. Former DSM Engineering Plastics product line is now with Envalior.
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Physical Properties	Metric	English	Comments

Density	1.56 g/cc	0.0564 lb/in³	Dry; ISO 1183
Moisture Absorption	1.60 %	1.60 %	Dry; Sim. to ISO 62
Linear Mold Shrinkage, Flow	0.0020 cm/cm	0.0020 in/in	Dry; ISO 294-4
Linear Mold Shrinkage, Transverse	0.0070 cm/cm	0.0070 in/in	Dry; ISO 294-4

Mechanical Properties	Metric	English	Comments
Tensile Strength at Break	260 MPa	37700 psi	Dry; ISO 527-1/-2
Elongation at Break	2.5 %	2.5 %	Dry; ISO 527-1/-2
Tensile Modulus	16.0 GPa	2320 ksi	Dry; ISO 527-1/-2
Charpy Impact, Notched	1.80 J/cm² @Temperature 23.0 °C	8.57 ft-lb/in² @Temperature 73.4 °F	Dry; ISO 179/1eA

Electrical Properties	Metric	English	Comments
Dielectric Constant	3.8 @Frequency 1e+9 Hz	3.8 @Frequency 1e+9 Hz	Dry; IEC 60250

Thermal Properties	Metric	English	Comments
Melting Point	315 °C	599 °F	10°C/min. Dry; ISO 11357-1/-3
Deflection Temperature at 1.8 MPa (264 psi)	245 °C	473 °F	Dry; ISO 75-1/-2
UL RTI, Electrical	85.0 °C @Thickness 0.750 mm	185 °F @Thickness 0.0295 in	UL746B
Flammability, UL94	HB @Thickness 3.00 mm	HB @Thickness 0.118 in	Dry; IEC 60695-11-10

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PDSM7934 / 291370

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