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Metal adhesives

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Master Bond EP17HTDA-1 One component, high temperature epoxy system for bonding and sealing
Categories: Polymer; Thermoset; Epoxy; Epoxy, High Temperature

Material Notes: Key Features:
  • Ideal for die attach applications
  • Resists temperatures up to +600°F
  • Meets MIL-STD-883J Section 3.5.2 for thermal stability
  • Meets NASA low outgassing specifications
Master Bond EP17HTDA-1 is a one component, heat cured epoxy system primarily for die attach applications as well as more conventional bonding and sealing. It requires no mixing and cures readily at 300-350°F. Typical curing schedules are 2-3 hours at 300°F or 1-2 hours at 350°F. Curing in this manner will result in a glass transition temperature (Tg) of 195-205°C. EP17HTDA-1 has the ideal consistency and flow for die attach applications. This epoxy system features excellent physical properties, superb electrical insulation along with good thermal conductivity, even at elevated temperatures. This system is also distinctive in that it has a relatively low exotherm upon curing. EP17HTDA-1 is 100% reactive and contains no solvents or diluents. EP17HTDA-1 bonds well to similar and dissimilar substrates such as metal, ceramics, plastics and composites. It has a noteworthy resistance to many chemicals including acids, bases, salts, fuels, oils and many solvents. Significantly, it has minimal shrinkage upon curing. Its service temperature range is from -80°F to +600°F. Since it passes NASA low outgassing, it can be used in vacuum type situations and other applications where that requirement is needed. EP17HTDA-1 is used primarily as a die attach and adhesive/sealant in electronic and related applications, where high temperature resistance, good electrical insulation properties and thermal conductivity are desirable.

Product Advantages:

  • Single component system; no mixing prior to use
  • High temperature resistance
  • Very good electrical insulation properties, even at higher temperatures
  • Ideal viscosity flow profile for die attaching
  • Good thermal conductivity
  • Excellent die shear strength

Information provided by Masterbond.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.77 g/cc
Solids Content 100 %
Viscosity 200000 - 2.50e+6 cPthixotropic
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 80 - 90
Tensile Strength 9000 - 10000 psi
Tensile Modulus 350000 - 400000 psi
Adhesive Bond Strength 2400 - 2600 psilap shear, Al/Al
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+15 ohm-cm
Dielectric Constant 4.3
@Frequency 60 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 20.0 - 25.0 µm/m-°C
Thermal Conductivity 1.4423 W/m-K
Maximum Service Temperature, Air 600 °F
Minimum Service Temperature, Air -80.0 °F
Glass Transition Temp, Tg 195 - 205 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 - 2.00 hour
@Temperature 177 °C
 2.00 - 3.00 hour
@Temperature 149 °C
Shelf Life 3.00 - 6.00 Month
@Temperature 4.44 - 10.0 °C
in original syringes
 
Descriptive Properties
Coloramber
Die Shear Strength24-27 kg-f(2 x 2 mm [80 x 80 mil])
Thixotropic Index1.77
Typical die size4-400 mm2

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PMASTM706 / 233763

Metal adhesives

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