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Elmet Technologies

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Arlon Electronic Materials 49N Multifunctional Epoxy Low-Flow Prepreg
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes: 49N is a low-flow epoxy prepreg engineered for bonding multilayer epoxy rigid-flex or attaching heat sinks to multilayer PCBs. With a high Tg, the prepreg can be used in high-performance or high-temperature applications compared to a standard difunctional epoxy low-flow.

  • Multifunctional epoxy resin system with a Tg of 170°C offers improved high-temperature and PTH reliability.
  • Engineered with discrete flow ranges and fiberglass styles to optimize flexibility
  • Electrical and mechanical properties meeting the requirements of IPC-4101/21, modified to be "Low-Flow"
  • RoHS/WEEE compliant
  • Short cure (45 minutes at 360°F) for improved manufacturing productivity

Typical Applications:

  • Bonding multilayer epoxy rigid-flex
  • Bonding adhesiveless epoxy rigid-flex
  • Attaching heat sinks to multilayer PCBs
  • Dielectric insulators

Information provided by ARLON Electronic Materials.
Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Physical PropertiesOriginal ValueComments
Density 1.75 g/ccASTM D792 Method A
Water Absorption 0.10 %IPC TM-650 2.6.2.1
 
Mechanical PropertiesOriginal ValueComments
Modulus of Elasticity 2600 ksiIPC TM-650 2.4.18.3
Flexural Strength 84.0 ksiIPC TM-650 2.4.4
Poissons Ratio 0.17ASTM D3039
Peel Strength 9.00 pliAfter Thermal Stress; IPC TM-650 2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 3.30e+12 ohm-cmE24/125; IPC TM-650 2.5.17.1
 2.60e+13 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 4.00e+12 ohmE24/125; IPC TM-650 2.5.17.1
 2.90e+13 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 4.4
@Frequency 1e+6 Hz		IPC TM-650 2.5.5.3
Dielectric Strength 1000 V/milIPC TM-650 2.5.6.2
Dissipation Factor 0.025
@Frequency 1e+6 Hz		IPC TM-650 2.5.5.3
 
Thermal PropertiesOriginal ValueComments
CTE, linear 14.0 - 16.0 µm/m-°CIPC TM-650 2.4.41
CTE, linear, Transverse to Flow 87.0 µm/m-°Cz, below Tg; IPC TM-650 2.4.24
 246 µm/m-°Cz, above Tg; IPC TM-650 2.4.24
Thermal Conductivity 0.250 W/m-KASTM E1461
Glass Transition Temp, Tg 170 °CDSC; IPC TM-650 2.4.25
Decomposition Temperature 291 °COnset; IPC TM-650 2.3.41
 302 °C5 percent; IPC TM-650 2.3.41
Flammability, UL94 V-0
 
Descriptive Properties
IPC Delamination - T260 (minutes)10IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)0IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)0IPC TM-650 2.4.24.1
Z-Axis Expansion (%)3.1IPC TM-650 2.4.24 (50-260°C)

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