Rogers Corporation RT/duroid® 6010.2LM Ceramic-PTFE Composite Microwave Laminate

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Rogers Corporation RT/duroid® 6010.2LM Ceramic-PTFE Composite Microwave Laminate
Categories:	Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE); Polytetrafluoroethylene (PTFE), Glass Filled, Molded
Material Notes:	Features: High dielectric constant for circuit size reduction Low loss - Ideal for operating at X-band or below Low Z-axis expansion. Provides reliable plated through holes in multi-layer boards Tight dielectric constant and thickness control for repeatable circuit performance Cladding - EDC or rolled copper foil, also thick aluminum, brass or copper plate (one side) Lead-free process compatible Typical Applications: Space Saving Circuitry Patch Antennas Ground Radar Warning Systems Satellite Communications Systems Power Amplifiers Aircraft Collision Avoidance Systems Information provided by Rogers Corporation.
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Physical Properties	Original Value	Comments

Density	3.10 g/cc	ASTM D792
Moisture Absorption at Equilibrium	0.010 % @Temperature 50.0 °C, Time 173000 sec	0.05 in.; IPC-TM-650 2.6.2.1
Thickness	5.00 - 100 mil	Range of Standard Thicknesses
Deformation	0.26 % @Pressure 7.00 MPa, Temperature 50.0 °C	Z direction; 24 hrs; ASTM D621
	1.37 % @Pressure 7.00 MPa, Temperature 150 °C	Z direction; 24 hrs; ASTM D621

Mechanical Properties	Original Value	Comments
Tensile Strength, Ultimate	13.0 MPa	Y direction; 0.1/min strain rate; ASTM D638
	17.0 MPa	X direction; 0.1/min strain rate; ASTM D638
Elongation at Break	7.0 - 14 %	Y direction; 0.1/min strain rate; ASTM D638
	9.0 - 15 %	X direction; 0.1/min strain rate; ASTM D638
Flexural Strength	32.0 MPa	Y direction, Condition A; ASTM D790
	36.0 MPa	X direction, Condition A; ASTM D790
Flexural Modulus	3751 MPa	Y direction, Condition A; ASTM D790
	4364 MPa	X direction, Condition A; ASTM D790
Compressive Yield Strength	47.0 MPa @Strain 25 %	Z direction; 0.05/min strain rate; ASTM D695
Compressive Modulus	2144 MPa	Z direction; 0.05/min strain rate; ASTM D695
Peel Strength	12.3 pli	Copper, after solder float; IPC-TM-650 2.4.8

Electrical Properties	Original Value	Comments
Volume Resistivity	5.00e+12 ohm-cm	Condition A; IPC 2.5.17.1
Surface Resistance	5.00e+12 ohm	Condition A; IPC 2.5.17.1
Dielectric Constant	9.95 - 10.45 @Frequency 1e+10 Hz	Z direction; IPC-TM-650 2.5.5.5
	10.9 @Frequency 8.00e+9 - 4.00e+10 Hz	Differential Phase Length Method
Dissipation Factor	0.0023 @Frequency 1e+10 Hz	Z direction; IPC-TM-650 2.5.5.5

Thermal Properties	Original Value	Comments
CTE, linear	24.0 µm/m-°C @Temperature 0.000 - 100 °C	X-Direction; 5°C/min; ASTM D3386
	24.0 µm/m-°C @Temperature 0.000 - 100 °C	Y-Direction; 5°C/min; ASTM D3386
	47.0 µm/m-°C @Temperature 0.000 - 100 °C	Z-Direction; 5°C/min; ASTM D3386
Specific Heat Capacity	1.00 J/g-°C	calculated
Thermal Conductivity	0.860 W/m-K @Temperature 80.0 °C	ASTM C518
Decomposition Temperature	500 °C	TGA; ASTM D3850
Flammability, UL94	V-0

Descriptive Properties
Thermal Coefficient of Dielectric Constant	-425 ppm/°C	IPC-TM-650 2.5.5.5; 10 GHz; -50°C to 170°C; Z-Direction

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PROGA975 / 138415

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