Rogers Corporation RT/duroid® 6010.2LM Ceramic-PTFE Composite Microwave Laminate

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Rogers Corporation RT/duroid® 6010.2LM Ceramic-PTFE Composite Microwave Laminate
Categories:	Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE); Polytetrafluoroethylene (PTFE), Glass Filled, Molded
Material Notes:	Features: High dielectric constant for circuit size reduction Low loss - Ideal for operating at X-band or below Low Z-axis expansion. Provides reliable plated through holes in multi-layer boards Tight dielectric constant and thickness control for repeatable circuit performance Cladding - EDC or rolled copper foil, also thick aluminum, brass or copper plate (one side) Lead-free process compatible Typical Applications: Space Saving Circuitry Patch Antennas Ground Radar Warning Systems Satellite Communications Systems Power Amplifiers Aircraft Collision Avoidance Systems Information provided by Rogers Corporation.
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Density	3.10 g/cc	0.112 lb/in³	ASTM D792
Moisture Absorption at Equilibrium	0.010 % @Temperature 50.0 °C, Time 173000 sec	0.010 % @Temperature 122 °F, Time 48.0 hour	0.05 in.; IPC-TM-650 2.6.2.1
Thickness	127 - 2540 microns	5.00 - 100 mil	Range of Standard Thicknesses
Deformation	0.26 % @Pressure 7.00 MPa, Temperature 50.0 °C	0.26 % @Pressure 1020 psi, Temperature 122 °F	Z direction; 24 hrs; ASTM D621
	1.37 % @Pressure 7.00 MPa, Temperature 150 °C	1.37 % @Pressure 1020 psi, Temperature 302 °F	Z direction; 24 hrs; ASTM D621

Mechanical Properties	Metric	English	Comments
Tensile Strength, Ultimate	13.0 MPa	1890 psi	Y direction; 0.1/min strain rate; ASTM D638
	17.0 MPa	2470 psi	X direction; 0.1/min strain rate; ASTM D638
Elongation at Break	7.0 - 14 %	7.0 - 14 %	Y direction; 0.1/min strain rate; ASTM D638
	9.0 - 15 %	9.0 - 15 %	X direction; 0.1/min strain rate; ASTM D638
Flexural Strength	32.0 MPa	4640 psi	Y direction, Condition A; ASTM D790
	36.0 MPa	5220 psi	X direction, Condition A; ASTM D790
Flexural Modulus	3.751 GPa	544.0 ksi	Y direction, Condition A; ASTM D790
	4.364 GPa	632.9 ksi	X direction, Condition A; ASTM D790
Compressive Yield Strength	47.0 MPa @Strain 25 %	6820 psi @Strain 25 %	Z direction; 0.05/min strain rate; ASTM D695
Compressive Modulus	2.144 GPa	311.0 ksi	Z direction; 0.05/min strain rate; ASTM D695
Peel Strength	2.16 kN/m	12.3 pli	Copper, after solder float; IPC-TM-650 2.4.8

Electrical Properties	Metric	English	Comments
Volume Resistivity	5.00e+12 ohm-cm	5.00e+12 ohm-cm	Condition A; IPC 2.5.17.1
Surface Resistance	5.00e+12 ohm	5.00e+12 ohm	Condition A; IPC 2.5.17.1
Dielectric Constant	9.95 - 10.45 @Frequency 1e+10 Hz	9.95 - 10.45 @Frequency 1e+10 Hz	Z direction; IPC-TM-650 2.5.5.5
	10.9 @Frequency 8.00e+9 - 4.00e+10 Hz	10.9 @Frequency 8.00e+9 - 4.00e+10 Hz	Differential Phase Length Method
Dissipation Factor	0.0023 @Frequency 1e+10 Hz	0.0023 @Frequency 1e+10 Hz	Z direction; IPC-TM-650 2.5.5.5

Thermal Properties	Metric	English	Comments
CTE, linear	24.0 µm/m-°C @Temperature 0.000 - 100 °C	13.3 µin/in-°F @Temperature 32.0 - 212 °F	X-Direction; 5°C/min; ASTM D3386
	24.0 µm/m-°C @Temperature 0.000 - 100 °C	13.3 µin/in-°F @Temperature 32.0 - 212 °F	Y-Direction; 5°C/min; ASTM D3386
	47.0 µm/m-°C @Temperature 0.000 - 100 °C	26.1 µin/in-°F @Temperature 32.0 - 212 °F	Z-Direction; 5°C/min; ASTM D3386
Specific Heat Capacity	1.00 J/g-°C	0.239 BTU/lb-°F	calculated
Thermal Conductivity	0.860 W/m-K @Temperature 80.0 °C	5.97 BTU-in/hr-ft²-°F @Temperature 176 °F	ASTM C518
Decomposition Temperature	500 °C	932 °F	TGA; ASTM D3850
Flammability, UL94	V-0	V-0

Descriptive Properties
Thermal Coefficient of Dielectric Constant	-425 ppm/°C		IPC-TM-650 2.5.5.5; 10 GHz; -50°C to 170°C; Z-Direction

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Rogers Corporation RT/duroid® 6006 Ceramic-PTFE Composite Microwave Laminate
Copper, Cu; Annealed
Rogers Corporation RT/duroid® 5880LZ Lightweight, High Frequency PTFE Laminate
Copper, Cu; Cold Drawn
AGC Fluon® FC123 PTFE, 15% Graphite Filled

PROGA975 / 138415

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message