Park Aerospace Nelco® N4000-2 Multifunctional Epoxy Laminate and Prepreg

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Park Aerospace Nelco® N4000-2 Multifunctional Epoxy Laminate and Prepreg
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	The Nelco® N4000-2 is the most established material of Nelco’s product line. This multifunctional epoxy laminate and prepreg system has a long history of use and one of the broadest operating and processing windows. Applications/Qualifications: Fine-Line Multilayers Surface-Mount Multilayers MCM-Ls PCMCIA Cards Wireless Communications Bluetooth Modules Automotive RoHS Compliant Meets IPC-4101/21 Specifications Information provided by Park Electrochemical Corp.
Key Words:	EP
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Physical Properties	Original Value	Comments

Density	1.92 g/cc	50% Resin Content; Internal Method
Water Absorption	0.10 %	IPC-TM-650.2.6.2.1

Mechanical Properties	Original Value	Comments
Modulus of Elasticity	3500 ksi	Y; ASTM D3039
	4100 ksi	X; ASTM D3039
Poissons Ratio	0.14	Y; ASTM D3039
	0.16	X; ASTM D3039
Peel Strength	7.00 pli	at elevated temperature; IPC-TM-650.2.4.8.2a
	9.00 pli	after exposure to process solutions; IPC-TM-650.2.4.8
	9.00 pli	after solder float; IPC-TM-650.2.4.8

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+13 ohm-cm	E - 24/125; IPC-TM-650.2.5.17.1
	1.00e+14 ohm-cm	C - 96/35/90; IPC-TM-650.2.5.17.1
Surface Resistance	1.00e+12 ohm	E - 24/125; IPC-TM-650.2.5.17.1
	1.00e+13 ohm	C - 96/35/90; IPC-TM-650.2.5.17.1
Dielectric Constant	4.1 @Frequency 1e+9 Hz	RF Impedance; IPC-TM-650.2.5.5.9
	4.3 @Frequency 1e+6 Hz	TFC/LCR Meter; IPC-TM-650.2.5.5.3
Dielectric Strength	1250 V/mil	IPC-TM-650.2.5.6.2
Dielectric Breakdown	>= 50000 V	IPC-TM-650.2.5.6
Dissipation Factor	0.023 @Frequency 1e+6 Hz	TFC/LCR Meter; IPC-TM-650.2.5.5.3
Arc Resistance	65 sec	IPC-TM-650.2.5.1

Thermal Properties	Original Value	Comments
CTE, linear	6.67 - 8.90 µin/in-°F @Temperature -40.0 - 125 °C	X/Y; IPC-TM-650.2.4.41
Specific Heat Capacity	0.290 - 0.330 BTU/lb-°F	ASTM E1461-92
Thermal Conductivity	2.08 - 2.78 BTU-in/hr-ft²-°F	ASTM E1461-92
Glass Transition Temp, Tg	130 °C	TMA; IPC-TM-650.2.4.24c
	140 °C	DSC; IPC-TM-650.2.4.25c
Decomposition Temperature	300 °C	5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94	V-0

Descriptive Properties
Methylene Chloride Resistance (% Weight Change)	0.7	IPC-TM-650.2.3.4.3
Pressure Cooker	Pass	60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)	8-12	IPC-TM-650.2.4.24.1
Z Axis Expansion (%)	4.5	50ºC to 260ºC; IPC-TM-650.2.4.41

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