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Metal adhesives

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Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive; Filled/Reinforced Thermoset

Material Notes: TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part formulation is free of solvents. TRA-DUCT 29121 can be screen printed, machine dispensed or stamped.

Information provided by Tra-Con Inc.

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Physical PropertiesOriginal ValueComments
Specific Gravity 3.00 g/ccMixed, degassed
Viscosity 44500 cP
@Temperature 25.0 °C
After mixing
 
Mechanical PropertiesOriginal ValueComments
Adhesive Bond Strength 1110 psiLap shear, alum to alum
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 125 °C
Minimum Service Temperature, Air -60.0 °C
Glass Transition Temp, Tg 62.0 °CUltimate Tg
 
Processing PropertiesOriginal ValueComments
Cure Time 0.750 min
@Temperature 175 °C
 1.50 hour
@Temperature 80.0 °C
 5.00 min
@Temperature 150 °C
 12.0 hour
@Temperature 50.0 °C
 15.0 min
@Temperature 120 °C
Pot Life 1440 min(1 day)
Working Life 48.0 hour
 
Descriptive Properties
Color Silver
Mix Ratio, parts by weight100/100Resin/Hardener
Thixotropic Index 3.21 rpm/10 rpm, cp #52

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Metal adhesives

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