TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part formulation is free of solvents. TRA-DUCT 29121 can be screen printed, machine dispensed or stamped. Information provided by Tra-Con Inc. |