Momentive Performance Materials TSE3281G Adhesive Sealant, Thermally Conductive

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Momentive Performance Materials TSE3281G Adhesive Sealant, Thermally Conductive (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Rubber or Thermoset Elastomer (TSE); Silicone; Silicone Elastomer, for Thermal Management
Material Notes:	One-part heat cure. Typical uses: For attaching power component to heat sink attachment and circuit substrate to baseplate adhesive. Data provided by the manufacturer, GE Silicones. GE Silicones became a part of Momentive Performance Materials in 2006.
Key Words:	RTV Silicones; R.T.V. Silicones
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Physical Properties	Original Value	Comments

Density	2.70 g/cc

Mechanical Properties	Original Value	Comments
Hardness, Shore A	83
Tensile Strength, Ultimate	4.51 MPa
Elongation at Break	40 %

Electrical Properties	Original Value	Comments
Dielectric Constant	5.4
Dielectric Strength	26.0 kV/mm

Processing Properties	Original Value	Comments
Processing Temperature	100 °C	Cure time 2 hr at this temperature.

**
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