Momentive Performance Materials TSE3281G Adhesive Sealant, Thermally Conductive

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Momentive Performance Materials TSE3281G Adhesive Sealant, Thermally Conductive (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Rubber or Thermoset Elastomer (TSE); Silicone; Silicone Elastomer, for Thermal Management
Material Notes:	One-part heat cure. Typical uses: For attaching power component to heat sink attachment and circuit substrate to baseplate adhesive. Data provided by the manufacturer, GE Silicones. GE Silicones became a part of Momentive Performance Materials in 2006.
Key Words:	RTV Silicones; R.T.V. Silicones
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Physical Properties	Metric	English	Comments

Density	2.70 g/cc	0.0975 lb/in³

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	83	83
Tensile Strength, Ultimate	4.51 MPa	654 psi
Elongation at Break	40 %	40 %

Electrical Properties	Metric	English	Comments
Dielectric Constant	5.4	5.4
Dielectric Strength	26.0 kV/mm	660 kV/in

Processing Properties	Metric	English	Comments
Processing Temperature	100 °C	212 °F	Cure time 2 hr at this temperature.

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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