COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.
Loctite® 3532 High viscosity Dam Encapsulant
Utilized in applications where COB density favors square or rectangular footprints, or where potting wells or indentations are not provided. "Dam" material controls flow of liquid encapsulant. |
