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Chemically Resistant adhesives

Parker Chomerics CHO-BOND® 584-29 Conductive Adhesive
Categories: Polymer; Adhesive; Thermoset
Material Notes: Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the material is offered in convenient premeasured "CHO-PAK" for rapid application. CHO-BOND® adhesive meets the most exacting electrical bonding requirements without the high temperatures, fluxes and expensive preparatory techniques usually needed to obtain effective lead-tin solder joints.

Information provided by Chomerics
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Physical PropertiesMetricEnglishComments
Specific Gravity 2.30 - 2.70 g/cc2.30 - 2.70 g/cc
Thickness 25.4 microns1.00 milRecommended
 
Mechanical PropertiesMetricEnglishComments
Shear Strength >= 8.27 MPa>= 1200 psi
 4.48 MPa
@Treatment Temp. 21.0 °C,
Time 86400 sec		650 psi
@Treatment Temp. 69.8 °F,
Time 24.0 hour		Lap
 6.21 MPa
@Treatment Temp. 65.0 °C,
Time 7200 sec		900 psi
@Treatment Temp. 149 °F,
Time 2.00 hour		Lap
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity  <= 0.0090 ohm-cm
@Treatment Temp. 65.0 °C,
Time 7200 sec		<= 0.0090 ohm-cm
@Treatment Temp. 149 °F,
Time 2.00 hour
 <= 0.050 ohm-cm
@Treatment Temp. 21.0 °C,
Time 86400 sec		<= 0.050 ohm-cm
@Treatment Temp. 69.8 °F,
Time 24.0 hour
 
Thermal PropertiesMetricEnglishComments
CTE, linear 49.0 µm/m-°C
@Temperature 20.0 °C		27.2 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 1.20 - 1.50 W/m-K8.33 - 10.4 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 125 °C257 °F
Minimum Service Temperature, Air -55.0 °C-67.0 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  15.0 min
@Temperature 113 °C		0.250 hour
@Temperature 235 °F
 1440 min
@Temperature 24.0 °C		24.0 hour
@Temperature 75.2 °F
 1440 min
@Temperature 24.0 °C		24.0 hour
@Temperature 75.2 °F
Pot Life >= 30 min>= 30 min
Working Life 30.0 min30.0 min
Shelf Life  9.00 Month
@Temperature 21.0 °C		9.00 Month
@Temperature 69.8 °F		Bulk; From date of manufacture
 12.0 Month
@Temperature 21.0 °C		12.0 Month
@Temperature 69.8 °F		Bi-Paks; From date of manufacture
 
Descriptive Properties
BinderEpoxy
ColorSilver/gray
ConsistencyThin Paste
Coverage156.1 cm2/g
FillerAg
Mix Ratio100:6.3584 : Hardener

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PCHOME050 / 28272

Chemically Resistant adhesives




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