Parker Chomerics CHO-BOND® 584-29 Conductive Adhesive

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Parker Chomerics CHO-BOND® 584-29 Conductive Adhesive
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the material is offered in convenient premeasured "CHO-PAK" for rapid application. CHO-BOND® adhesive meets the most exacting electrical bonding requirements without the high temperatures, fluxes and expensive preparatory techniques usually needed to obtain effective lead-tin solder joints. Information provided by Chomerics
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Physical Properties	Original Value	Comments

Specific Gravity	2.30 - 2.70 g/cc
Thickness	1.00 mil	Recommended

Mechanical Properties	Original Value	Comments
Shear Strength	>= 1200 psi
	650 psi @Treatment Temp. 21.0 °C, Time 86400 sec	Lap
	900 psi @Treatment Temp. 65.0 °C, Time 7200 sec	Lap

Electrical Properties	Original Value	Comments
Volume Resistivity	<= 0.0090 ohm-cm @Treatment Temp. 65.0 °C, Time 7200 sec
	<= 0.050 ohm-cm @Treatment Temp. 21.0 °C, Time 86400 sec

Thermal Properties	Original Value	Comments
CTE, linear	49.0 µm/m-°C @Temperature 20.0 °C
Thermal Conductivity	1.20 - 1.50 W/m-K
Maximum Service Temperature, Air	125 °C
Minimum Service Temperature, Air	-55.0 °C

Processing Properties	Original Value	Comments
Cure Time	0.250 hour @Temperature 113 °C
	24.0 hour @Temperature 24.0 °C
	24.0 hour @Temperature 24.0 °C
Pot Life	>= 30 min
Working Life	0.500 hour
Shelf Life	9.00 Month @Temperature 21.0 °C	Bulk; From date of manufacture
	12.0 Month @Temperature 21.0 °C	Bi-Paks; From date of manufacture

Descriptive Properties
Binder	Epoxy
Color	Silver/gray
Consistency	Thin Paste
Coverage	156.1 cm²/g
Filler	Ag
Mix Ratio	100:6.3	584 : Hardener

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PCHOME050 / 28272

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