Features:- Low loss for excellent high frequency performance
- Tight dielectric constant and thickness control
- Excellent electrical and mechanical properties
- Extremely low thermal coefficient of dielectric constant
- In-plane expansion coefficient matched to copper
- Very low etch shrinkage
- Copper Cladding - Electrodeposited foil, Resistive foils, Rolled
- Lead-free process compatible
Typical Applications: - Phase Array Antennas
- Ground Based and Airborne Radar Systems
- Global Positioning System Antennas
- Power Backplanes
- High Reliability Complex Multilayer Circuits
- Commercial Airline Collision Avoidance Systems
- Beam Forming Networks
Information provided by Rogers Corporation. |