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Master Bond adhesives

Beryllium Copper, UNS C17300, TH04 Temper wire, <2 mm
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Good to excellent corrosion resistance. Excellent cold workability; good hot formability. Commonly fabricated by blanking, forming and bending, turning, drilling, tapping.

Applications: springs, flexible metal hose, Bourdon tubing, bellows, clips, washers, retaining rings, and other parts subject to severe forming conditions but require high strength, anelasticity, and fatigue and creep resistance; in parts that require high strength or wear resistance along with good electrical conductivity and/or magnetic characteristics such as navigational instruments, non-sparking safety tools, firing pins, bushings, valves, pumps, shafts, and rolling mill parts.

TH04 temper wire; <2 mm; aged 1 hour at 330°C.

Key Words: BeCu; CDA 173, ISO CuBe2Pb, CEN CW102C; Alloy M25
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Physical PropertiesMetricEnglishComments
Density 8.25 g/cc0.298 lb/in³during age hardening, 2% max. decrease in length and 6% max. increase in density.
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Ultimate 1310 - 1590 MPa190000 - 231000 psi
Tensile Strength, Yield 1240 - 1410 MPa180000 - 205000 psi
Elongation at Break 1.0 - 3.0 %1.0 - 3.0 %
Modulus of Elasticity 125 - 130 GPa18100 - 18900 ksi
Poissons Ratio 0.300.30
Machinability 50 %50 %UNS C36000 (free-cutting brass) = 100%
Shear Modulus 50.0 GPa7250 ksi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.0000069 - 0.0000078 ohm-cm
@Temperature 20.0 °C
0.0000069 - 0.0000078 ohm-cm
@Temperature 68.0 °F
 
Thermal PropertiesMetricEnglishComments
CTE, linear  16.7 µm/m-°C
@Temperature 20.0 - 100 °C
9.28 µin/in-°F
@Temperature 68.0 - 212 °F
 17.0 µm/m-°C
@Temperature 20.0 - 200 °C
9.44 µin/in-°F
@Temperature 68.0 - 392 °F
 17.8 µm/m-°C
@Temperature 20.0 - 300 °C
9.89 µin/in-°F
@Temperature 68.0 - 572 °F
Specific Heat Capacity 0.420 J/g-°C0.100 BTU/lb-°F
Thermal Conductivity  105 - 130 W/m-K
@Temperature 20.0 °C
729 - 902 BTU-in/hr-ft²-°F
@Temperature 68.0 °F
 130 - 133 W/m-K
@Temperature 200 °C
902 - 923 BTU-in/hr-ft²-°F
@Temperature 392 °F
Melting Point 865 - 980 °C1590 - 1800 °F
Solidus 865 °C1590 °F
Liquidus 980 °C1800 °F
 
Processing PropertiesMetricEnglishComments
Processing Temperature 845 °C1550 °FHot-Shortness Temperature
Annealing Temperature 760 - 790 °C1400 - 1450 °F
Solution Temperature 760 - 790 °C1400 - 1450 °F
Aging Temperature 260 - 425 °C500 - 797 °F
Hot-Working Temperature 650 - 800 °C1200 - 1470 °F
Precipitation Temperature 316 °C
@Time 180 sec
600 °F
@Time 0.0500 hour
Air
Recrystallization Temperature 730 °C1350 °F
 
Component Elements PropertiesMetricEnglishComments
Beryllium, Be 1.8 - 2.0 %1.8 - 2.0 %
Co + Ni >= 0.20 %>= 0.20 %
Co + Ni + Fe <= 0.60 %<= 0.60 %
Copper, Cu 97 %97 %
Lead, Pb 0.20 - 0.60 %0.20 - 0.60 %
Other, total <= 0.50 %<= 0.50 %

References for this datasheet.

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MC17300e1 / 10869

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