Thermal Ceramics TE 1800 Board and Shapes Molded Min-K Insulation

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Thermal Ceramics TE 1800 Board and Shapes Molded Min-K Insulation
Categories:	Ceramic
Material Notes:	Min-K TE 1800 was developed for non-loadbearing applications and can be machined to shape. TE 1800 has been used in contact with silicon-germanium thermoelectric devices. Features: Microporous Low thermal conductivity Compression resistant Machined to customer specification Lightweight Organic Applications: Aerospace High temperature Thermoelectric devices Instrumentation and analytical equipment Information provided by Thermal Ceramics Data has not been recently verified. Please contact manufacturer for current information.
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Physical Properties	Metric	English	Comments

Density	0.320 g/cc	0.0116 lb/in³

Mechanical Properties	Metric	English	Comments
Transverse Strength	>= 0.345 MPa	>= 50.0 psi
Compressive Yield Strength	0.655 MPa	95.0 psi	5% compression
	1.07 MPa	155 psi	8% compression

Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.0331 W/m-K @Temperature 149 °C	0.230 BTU-in/hr-ft²-°F @Temperature 300 °F
	0.0331 W/m-K @Temperature 204 °C	0.230 BTU-in/hr-ft²-°F @Temperature 400 °F
	0.0346 W/m-K @Temperature 316 °C	0.240 BTU-in/hr-ft²-°F @Temperature 600 °F
	0.0360 W/m-K @Temperature 427 °C	0.250 BTU-in/hr-ft²-°F @Temperature 800 °F
	0.0403 W/m-K @Temperature 538 °C	0.280 BTU-in/hr-ft²-°F @Temperature 1000 °F
	0.0490 W/m-K @Temperature 649 °C	0.340 BTU-in/hr-ft²-°F @Temperature 1200 °F
	0.0720 W/m-K @Temperature 871 °C	0.500 BTU-in/hr-ft²-°F @Temperature 1600 °F
Maximum Service Temperature, Air	982 °C	1800 °F

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CTHERM210 / 2530

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