MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Master Bond adhesives

Lord Adhesives Thermoset™ ES-111 Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: LORD Thermoset ES-111 epoxy encapsulant is a two-component system designed specifically for high voltage, automotive ignition coils, where excellent adhesion to segmented bobbins is critical.

Features: maintains low viscosity for complete and void-free encapsulation. provides excellent resistance to thermal shock. developed specifically for electrical stability at high temperature.

All information provided by Lord.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.20 g/cc1.20 g/ccES-111 Hardener
 1.63 g/cc1.63 g/ccMixed
 1.83 g/cc1.83 g/ccES-111 Resin
Viscosity  100 cP
@Temperature 25.0 °C
100 cP
@Temperature 77.0 °F
ES-111 Hardener
 8000 cP
@Temperature 25.0 °C
8000 cP
@Temperature 77.0 °F
Mixed
 130000 cP
@Temperature 60.0 °C
130000 cP
@Temperature 140 °F
ES-111 Resin
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 9090ASTM D 2240
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+14 ohm-cm
@Temperature 25.0 °C
>= 1.00e+14 ohm-cm
@Temperature 77.0 °F
cured; ASTM D 257
Dielectric Constant <= 4.0
@Frequency 1000 Hz,
Temperature 25.0 °C
<= 4.0
@Frequency 1000 Hz,
Temperature 77.0 °F
cured; ASTM D 150
Dielectric Strength 30.0 kV/mm762 kV/inASTM D 149
Dissipation Factor <= 0.50
@Frequency 1000 Hz,
Temperature 25.0 °C
<= 0.50
@Frequency 1000 Hz,
Temperature 77.0 °F
cured; ASTM D 150
 
Thermal PropertiesMetricEnglishComments
CTE, linear 40.0 µm/m-°C22.2 µin/in-°Falpha 1; ASTM D 696
 129 µm/m-°C71.7 µin/in-°Falpha 2; ASTM D 696
Glass Transition Temp, Tg 145 °C293 °Fby TMA
 
Processing PropertiesMetricEnglishComments
Working Life 1440 min
@Temperature 25.0 °C
1440 min
@Temperature 77.0 °F
Mixed
Gel Time 70.0 min
@Temperature 100 °C
70.0 min
@Temperature 212 °F
Shelf Life 12.0 Month
@Temperature 25.0 °C
12.0 Month
@Temperature 77.0 °F
each component from date of manufacture
 
Descriptive Properties
AppearanceGrey, Opaque PasteES-111 Resin
 Grey, thick liquidMixed
 Light Yellow, Transparent LiquidES-111 Hardener
Storage Modulus2 GPa

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

PLORD9308 / 232664

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.