Lord Adhesives Thermoset™ ES-111 Epoxy Encapsulant

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Lord Adhesives Thermoset™ ES-111 Epoxy Encapsulant
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	LORD Thermoset ES-111 epoxy encapsulant is a two-component system designed specifically for high voltage, automotive ignition coils, where excellent adhesion to segmented bobbins is critical. Features: maintains low viscosity for complete and void-free encapsulation. provides excellent resistance to thermal shock. developed specifically for electrical stability at high temperature. All information provided by Lord.
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Physical Properties	Original Value	Comments

Specific Gravity	1.20 g/cc	ES-111 Hardener
	1.63 g/cc	Mixed
	1.83 g/cc	ES-111 Resin
Viscosity	100 cP @Temperature 25.0 °C	ES-111 Hardener
	8000 cP @Temperature 25.0 °C	Mixed
	130000 cP @Temperature 60.0 °C	ES-111 Resin

Mechanical Properties	Original Value	Comments
Hardness, Shore D	90	ASTM D 2240

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+14 ohm-cm @Temperature 25.0 °C	cured; ASTM D 257
Dielectric Constant	<= 4.0 @Frequency 1000 Hz, Temperature 25.0 °C	cured; ASTM D 150
Dielectric Strength	762 V/mil	ASTM D 149
Dissipation Factor	<= 0.50 @Frequency 1000 Hz, Temperature 25.0 °C	cured; ASTM D 150

Thermal Properties	Original Value	Comments
CTE, linear	40.0 µm/m-°C	alpha 1; ASTM D 696
	129 µm/m-°C	alpha 2; ASTM D 696
Glass Transition Temp, Tg	145 °C	by TMA

Processing Properties	Original Value	Comments
Working Life	1440 min @Temperature 25.0 °C	Mixed
Gel Time	70.0 min @Temperature 100 °C
Shelf Life	12.0 Month @Temperature 25.0 °C	each component from date of manufacture

Descriptive Properties
Appearance	Grey, Opaque Paste	ES-111 Resin
	Grey, thick liquid	Mixed
	Light Yellow, Transparent Liquid	ES-111 Hardener
Storage Modulus	2 GPa

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PLORD9308 / 232664

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